Aw shucks, thanks Leland!
-----Original Message-----
From: Leland Woodall [mailto:[log in to unmask]]
Sent: Wednesday, January 26, 2011 1:58 PM
To: Stadem, Richard D.
Subject: RE: [TN] Lead Free / Lead policy
Richard,
That was an absolutely incredible engineering feat! I congratulate you
on developing such a marvel. Never seen anything like it.
Leland
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Stadem, Richard D.
Sent: Wednesday, January 26, 2011 8:43 AM
To: [log in to unmask]
Subject: Re: [TN] Lead Free / Lead policy
It depends (trademark use approved by Doug Pauls, Rockwell Collins).
In high-reliability applications the lead-free solder requirement of
RoHS does not apply, but you need to determine if your application is
RoHS-exempt or not. If it is, then you can solder with standard 63/37
solder, and you should be able to solder pretty much any component
termination finish without any issues, with the exception of the
potential for tin whiskers. To prevent tin whiskers, the components that
have a lead finish of 99% tin should be tinned with 63/37 solder as
close to the component body as possible. This is a requirement for
certain industries covered in J-STD-001E and J-STD-001DS.
Here at GD, and also at certain other high-reliability client companies
I work for, there are strict controls over the use of unleaded solder
and it is rarely used. We developed a robotic tinning cell with V-Tek
that automatically de-tapes, cleans, tins, and re-tapes the full range
of component types to within .010" of the component body for most
component types, and that is the best tin-whisker mitigation scheme
possible. Read about it here:
http://www.circuitsassembly.com/cms/magazine/209/9439/.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Christopher Young
Sent: Wednesday, January 26, 2011 5:18 AM
To: [log in to unmask]
Subject: [TN] Lead Free / Lead policy
Hi, anyone know what the policy is regarding the use and protection
from failure of mixed lead and non lead components and soldering
process. Does anyone have a company philosophy or policy as I believe
this is a requirement for Fire and Avionics environment.
Thanks
chris
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