It depends (trademark use approved by Doug Pauls, Rockwell Collins).
In high-reliability applications the lead-free solder requirement of RoHS does not apply, but you need to determine if your application is RoHS-exempt or not. If it is, then you can solder with standard 63/37 solder, and you should be able to solder pretty much any component termination finish without any issues, with the exception of the potential for tin whiskers. To prevent tin whiskers, the components that have a lead finish of 99% tin should be tinned with 63/37 solder as close to the component body as possible. This is a requirement for certain industries covered in J-STD-001E and J-STD-001DS.
Here at GD, and also at certain other high-reliability client companies I work for, there are strict controls over the use of unleaded solder and it is rarely used. We developed a robotic tinning cell with V-Tek that automatically de-tapes, cleans, tins, and re-tapes the full range of component types to within .010" of the component body for most component types, and that is the best tin-whisker mitigation scheme possible. Read about it here: http://www.circuitsassembly.com/cms/magazine/209/9439/.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Christopher Young
Sent: Wednesday, January 26, 2011 5:18 AM
To: [log in to unmask]
Subject: [TN] Lead Free / Lead policy
Hi, anyone know what the policy is regarding the use and protection
from failure of mixed lead and non lead components and soldering
process. Does anyone have a company philosophy or policy as I believe
this is a requirement for Fire and Avionics environment.
Thanks
chris
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