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January 2011

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Subject:
From:
Chris Knudsen <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Chris Knudsen <[log in to unmask]>
Date:
Fri, 21 Jan 2011 17:00:42 -0500
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Thanks everyone for the input.

I'll try not to think about this all weekend... but I probably will.

Please continue to send any additional thoughts or recommendations.

Best regards,

Chris
NER


On 1/21/2011 10:05 AM, Chris Knudsen wrote:
> ...you work for a small, albeit successful OEM.  You produce 
> short-run, custom electronics.  A 'production run' may be 10-50 units.
>
> _Everything_ is a prototype.
>
> Suppose you have this potentially irrational desire to solder all your 
> pcb's in-house.
>
> Assuming:
> -- Dealing with component placement and paste/screening is not an issue.
> -- You tend to (sadly) avoid challenging chip packages.  However, due 
> to availability of the more colorful components,  this becomes more 
> difficult every year.
> -- The economics are "manageable".
> -- Inspection and QA are in place.
> -- Damn the torpedoes.
>
> **What type of low-volume soldering solutions would you recommend?
>
> I've tested one name-brand, IR convection, batch, reflow-oven and 
> found unacceptable hot/cold spots (manufacturer will go unnamed).
>
> **Is Vapor-phase on this scale an option?
>
> **Typical hardware costs/concerns/safety issues?
>
> **Required infrastructure?
>
> Any suggestions from technet-nation would be most appreciated.
>
> Offline responses would be fine (especially if naming names).  
> However, perhaps others may benefit from from your experience and 
> recommendations.
>
> Best regards to all,
>
> Chris Knudsen
> New England Research, Inc.
>
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