Ioan,

I'm not up to snuff on SMT pick and place machines, but this type of process
can typically be handled by most Flip Chip bonders.  If using flux, one
needs to make sure the level of flux/depth of immersion is consistent and
controlled.

You might just try to do a Google search for those [Flip Chip Bonders & POP,
for example].  I am sure that the Amkor's, STATpac's, and Tessera's of the
world are using standard equipment.

There are also lab model flip chip bonders [manual] that can do this in a
low volume developmental phase

A few automatic machine suppliers to look into - 
http://www.datacon.at/

http://www.panasonicfa.com/?id=advanced%20packaging%20lab

and a few other company names that come to mind

Siemens

KME

Shinkawa

K&S

F&K

H&K

You might search archives in ChipScale review magazine for further equipment
info and references.  They typically publish equipment supplier summaries on
the various types of bonders used in microelectronics assy.  I don't happen
to have one at my fingertips, but if you absolutely can not find one, let me
know - 

http://www.chipscalereview.com/issues/0109/index.php

You could do the same with Advanced Packaging -
http://www.electroiq.com/index/packaging.html

Or Solid State Technology magazine -
http://www.electroiq.com/index/Semiconductors/sst-past-issues.html







Manual FC bonders - http://www.finetechusa.com/

http://www.norana.com.tr/MicroAssembly.htm


Possibly the Surface mount industry has something to do this, but I lean
back into familiar territory.

Regards


Steve Creswick
http://www.linkedin.com/in/stevencreswick






-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Ioan Tempea
Sent: Wednesday, January 19, 2011 9:21 AM
To: [log in to unmask]
Subject: [TN] Handling of PoP on assembly equipment

Dear Technos,

 

I need to know how package on package is assembled in real life. Attended
Bob Willis' course and found it very good, it's just that neither of our
Mudata or Fuji IP3 machines are able to handle this process
(pick-dip-place).

 

So, how are you doing it? Which insertion machines can handle the process
and if you do it in an automatic-manual manner, how do you go about it?

 

Thanks,

 

Ioan Tempea, ing.
Ingénieur Principal de Fabrication / Senior Manufacturing Engineer
T | 450.967.7100 ext.244
E | [log in to unmask] <mailto:[log in to unmask]>  
W | www.digico.cc <http://www.digico.cc/> 

 
 N'imprimer que si nécessaire - Print only if you must

 


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