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January 2011

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Subject:
From:
Ioan Tempea <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Ioan Tempea <[log in to unmask]>
Date:
Wed, 19 Jan 2011 09:20:36 -0500
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Dear Technos,

 

I need to know how package on package is assembled in real life. Attended Bob Willis' course and found it very good, it's just that neither of our Mudata or Fuji IP3 machines are able to handle this process (pick-dip-place).

 

So, how are you doing it? Which insertion machines can handle the process and if you do it in an automatic-manual manner, how do you go about it?

 

Thanks,

 

Ioan Tempea, ing.
Ingénieur Principal de Fabrication / Senior Manufacturing Engineer
T | 450.967.7100 ext.244
E | [log in to unmask] <mailto:[log in to unmask]>  
W | www.digico.cc <http://www.digico.cc/> 

 
 N'imprimer que si nécessaire - Print only if you must

 


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