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January 2011

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Subject:
From:
Cedric ORAIN <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Cedric ORAIN <[log in to unmask]>
Date:
Mon, 17 Jan 2011 11:34:39 +0100
Content-Type:
text/plain
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text/plain (313 lines)
Dear Chris,

We managed last year the qualification of PoP assembly process for prototype
and low volume application. 

As we were not responsible in design matters, I'm not able to advise you in
this field. 

However, regarding SMD process, I can say that the job was essentially
about:
- how much flux or solder paste around the balls of the TOP component
- setting the reflow profile to avoid troubles due to oxidation (head and
pillow effect, grapping). It was a challenging point under air atmosphere +
SAC105 balls.

Regarding the technology of the packages, I could also advise to be vigilant
about wrapping of both components and to evaluate the reliability of ball
attachments on the side of the bottom component.

I've not much more time to be more precise but don't hesitate to ask more
precise question later if you need.

Regards,

Cedric
Technical Director
Inovelec group 

Electronic Manufacturing Services

www.inovelec-groupe.com
+33 (0)5 53 35 48 38




-----Message d'origine-----
De : TechNet [mailto:[log in to unmask]] De la part de Christopher Young
Envoyé : lundi 17 janvier 2011 09:30
À : [log in to unmask]
Objet : Re: [TN] POP Technology

Can someone give me their experience of POP technology (Placement on
Placement) OMAP and memory FPGA devices, and other pitfalls experienced.

Regards

Chris  

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Brian Ellis
Sent: 15 January 2011 14:43
To: [log in to unmask]
Subject: Re: [TN] NTC Friday Element Quiz - the Answer

In 78 years, 58 of them since I graduated as an electronics engineer or 
68 of them since I built my first crystal set, but having worked on the 
chemical side of electronics assembly since 1957, I'm with you all the 
way, Bev.

Brian

On 15/01/2011 14:07, Bev Christian wrote:
> Dear Mr. Hillman,
> I was a little taken aback when in an earlier quiz you labeled
antimony as a
> metal rather than as a metalloid, but I can live with it, I guess.
However,
> for you to call silicon a metal is just too much!  In 57 years, 41 of
those
> as a chemist (I am counting from when I decided to be one in grade 9),
I
> have NEVER before now heard anyone call silicon a metal.  As a main
group
> chemist (fluorine chemist actually), I consider it a non-metal and am
> willing to concede it is a metalloid, but metal? Never! You are
poaching,
> sir. I will stop short of demanding satisfaction.  However, I do ask
you to
> respond and I also ask fellow TechNetters their opinion on this.
>
> Bev
> RIM
>
> PS For those of you new to TechNet Dave IS a dear friend and this is
all
> pretty well tongue in cheek.  And seeing this venue is overrun with
> engineers, rather than scientists, I highly expect I am going to be
> out-voted, shot down in flames, made into toast and other
alliterations.
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of David D. Hillman
> Sent: Friday, January 14, 2011 4:03 PM
> To: [log in to unmask]
> Subject: [TN] NTC Friday Element Quiz - the Answer
>
> Hi folks - Here is the Friday Element Quiz Answer:
>
> The Question:
>
> The first "pure" use of this element began in 1823. This element is
> sometimes classified as a metalloid. The density of this element
increases
>
> when it is melted. The native oxide of this element prevents further
> oxidation of the element below 900C. What element is being described?
>
> The Answer:
> The element is Silicon (Si). Silicon is a metal that enables
technology in
> a multitude of ways. Silicon is a deoxidizer in steel production, the
> basis for integrated circuits, glass, cement, protective coatings for
high
> temperature applications, and families of polymers. Ge atoms are
larger
> than Si atoms so an alloy of 85%Si and 15% Ge has an average
interatomic
> spacing slightly larger than pure Si. When a pure layer of Si is
deposited
> on the 85/15 alloy, the Si becomes strained resulting in a 70% faster
> signal speed parallel to the surface! Less than 1% of the world's
> production of Si is the pure form but that 1% (approximately 40K
> tons/year) is roughly equal in total dollar value to the other 99% of
the
> metallic Si production.
>
>
>
> Lots of good guesses (this was one of the tougher quizzes) - the
winner of
> this week's quiz is Bev Christian of RIM. Clumpy have to sneak onto
the
> A380 in Germany and head for Canada:
>
> So far Clumpy has:
>
> Week 1 Lamar Young, SCS Coatings
> - accomplished nothing (drank lots of coffee)
>
> Week 2 Bev Christian, RIM
> - conducted REACH material testing
>
> Week 3 Drew Meyer, Benchmark Electronics Inc.
> - Solderability testing and mowed the lawn
>
> Week 4 Ian Fox, Goodrich
> - had an epic journey of travel
>
> Week 4 Gary Ferrari, Garrick Global
> - unknown
>
> Week 5 Fredrick Miller, Astrolab
> - unknown
>
> Week 6 David Nelson, Raytheon
> - Was a tackling dummy for Dallas Cowboys
>
> Week 7 Graham Collins, L3 Communications
> - Cleaned gutters and painted window trim
>
> Week 8 Bill Noel, ITT Geospatial Systems Division
> - unknown
>
> Week 9 Steve Gregory of RD Circuits
> - unknown
>
> Week 10 David Bealer of Watchfire Signs
> - descaled the in-line wash machine! Ouch!
>
> Week 11 Dick Krug of Sparton Corporation
> - assisted with AS9100 quality management systems requirements audit
>
> Week 12 Steve Creswick of Balanced Enterprise Solutions
> - Acted as Steve's "go fer" due to a broken leg!
>
> Week 13 Gebhard Neifer, Delphi
> - conducted a plasma pre treatment Taguchi DOE for a sealing process
>
> Week 14 Bev Christian, RIM
> - ????
>
> Have a good weekend.
>
> Dave Hillman
> Rockwell Collins
> [log in to unmask]
>
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