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January 2011

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Subject:
From:
"Whittaker, Dewey (EHCOE)" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Whittaker, Dewey (EHCOE)
Date:
Thu, 13 Jan 2011 13:26:45 -0700
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Stick with Coca-Cola. Things always go better with Coke.
Dewey

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Christopher Young
Sent: Thursday, January 13, 2011 9:15 AM
To: [log in to unmask]
Subject: Re: [TN] Trace Widths Entering SMT

Could someone tell me their experience they have with POP technology and
related problems regarding flux / placement / process / any other.

 

 

Thanks

 

Chris young

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Reuven Rokah
Sent: 13 January 2011 16:11
To: [log in to unmask]
Subject: Re: [TN] Trace Widths Entering SMT

Trace wisth entering SMT pads should not be bigger than 80% of the pad
width.


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Pete
Sent: Thursday, January 13, 2011 5:24 PM
To: [log in to unmask]
Subject: Re: [TN] Trace Widths Entering SMT

I think you just took this topic a different direction.

IR boards most certainly do not heat evenly.  But the original question 
about a blanket rule about maximum .020" trace (or replacing a .050 
w/ 3 .020 traces) didn't sound related to that problem.  

Uneven copper distribution, parts sinking heat, large copper areas.. 
you can't ignore those.  Trace sizes can effect balanced heating, but 
they fall a little further down the list, and there's a lot more to it
than 
simply spec'ing a maximum width.

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