Hello TechNet World.
Anyone like to comment, suggest, direction to take, on the requirements of J-STD-001 Class 3 Section 4.5?
It is my understanding and experience that the plating thickness that manufacturers specify on their contacts is a reference to the overall contact, and that the percentage of gold 'inside' the cup varies greatly, hence the double tinning process requirement. Most contact manufacturers specify that their gold plating thickness is around 1.0 µm, which most engineers that have no soldering experience believe gold removal is not required, nor objective evidence is required.
Any info is greatly appreciated.
I have experienced firsthand, gold embrittlement issues in the past when working to MIL-STD-2000
Regards.
Bryon Boone
CIT, Product Engineer III
Carlisle Interconnect Technologies
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