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January 2011

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TechNet E-Mail Forum <[log in to unmask]>, Carl VanWormer <[log in to unmask]>
Date:
Mon, 3 Jan 2011 17:02:49 -0800
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TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
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From:
Phil Bavaro <[log in to unmask]>
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Hi Carl,

First I would recommend that you get yourself a copy of Kwick-fit
panelization software.

I will send you independently what I came up with in just five minutes
.....your panel (16 up) is going to cost you a lot more than it could.

Your approach is very similar to a lot of designs I have seen in the
past....but just keep in mind that depaneling is not something that you
should consider only in afterthought.  You have definitive keep out for
chips with respect to scored edges, etc.

Pizza cutters are the commonly accepted method of depaneling scored
arrays.....

Phil

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Carl VanWormer
Sent: Monday, January 03, 2011 4:16 PM
To: [log in to unmask]
Subject: [TN] Looking for guidance on specifying panel of small PC
boards

I have created a file ( http://www.cipher.com/Panelization02.jpg) that
is my guess at a PCB panel that will meet the following goals.

1.       A bunch of boards to reduce handling costs.

2.       Not too much waste.

3.       Side rails to keep the system from being too "wobbly" (that's a
technical term).

4.       Routed slots between boards to minimize twisting forces during
hand de-paneling.

 

The circuit boards will be made from .062" FR-4, and are each
2.875"x1.125".  the surface mounted parts will be placed, then fed to
the IR re-flow oven for the first pass of processing.  Then, the
through-hole connectors will be added at both ends of each board and the
panel will be wave soldered to attach the connectors.  The board will go
through the wave in the direction of the long axis.

 

My picture has interior single lines representing V-Scores, and thick
gray lines representing routed slots between pairs of boards. My goal is
for hand separation of the boards, with minimal forces on the chips on
the interior of the board area.   My hope is that one of the long side
rails (green) can be broken off, then each pair of boards can be snapped
from the other long side rail (green), then the pairs of boards can be
snapped apart.

 

I am making a lot of guesses from things I've seen before.  I'm looking
for guidance on how to specify panels that will be considered "good" by
all parties involved in the processing chain.  Are there published
documents that can help me look like an expert (without too much work on
my part)?

 

Thanks,

Carl

 

 

 

 

Carl Van Wormer, P.E., AE7GD

Senior Hardware Engineer

Cipher Systems

1800 NW 169th Place, Suite B-100

Beaverton, OR  97006

Cipher Systems (503) 617-7447 x 5163

Direct Line (503) 425-5163

[log in to unmask] <mailto:[log in to unmask]> 

This message may contain confidential and/or proprietary information,
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you by mistake, please be nice and delete it, then tell me of my mistake
so I can send it to the right person.

 


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