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Subject:
From:
"Stadem, Richard D." <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Stadem, Richard D.
Date:
Thu, 9 Dec 2010 09:09:13 -0600
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Torsten, how did this turn out?

-----Original Message-----
From: Stadem, Richard D. 
Sent: Wednesday, November 24, 2010 9:11 AM
To: [log in to unmask]; 'Torsten Hagge'
Subject: RE: [TN] modelling material/dough for wave soldering

Hi, Torsten
What you are probably looking for is Chavant Y2-Klay, or CM-70 or J-88.

http://www.chavant.com/new_site/index.htm

Y2-Klay is a good choice, it cures very hard is lightweight, and is easy to machine or tool after it is cured. It is an industrial modeling clay, and I have used it many times for design work. 
It is also a low-sulphur clay. You do NOT want a high sulphur content, as it can cause certain finishes to react, especially immersion silver, ENIG, and immersion tin.
Please let me know what you chose, and how it works.
Thanks
Dean Stadem

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Torsten Hagge
Sent: Wednesday, November 24, 2010 7:42 AM
To: [log in to unmask]
Subject: [TN] modelling material/dough for wave soldering

Hi technetters,

has somebody knowledge about a modelling material/dough which can be used to build up fixtures for wave soldering process? 
We have heard that it gives a material which can be placed over the components and which is hardened by the first solder process to be used for many cycles, any idea about type/vendor?

Thanks and best regards,
Torsten


i.A. Dipl.Ing.(FH)Torsten Hagge
tech. projectmanager
Kristronics GmbH
Gewerbegrund 5 - 9
24955 Harrislee
 
Tel.:    +49 461 7741 624
Fax:     +49 461 7741 642
[log in to unmask]
www.kristronics.de
 
Gerichtsstand Flensburg, Handelsregister: HRB 1433 FL
Geschäftsführer Dipl.-Ing. oec. Thormod Ohm
Ust-Id-Nr. DE 811182059
Bankverbindung: Deutsche Bank AG Flensburg, Konto-Nr. 4216610, BLZ 21570011
IBAN: DE32 2157 0011 0421 6610 00, BIC: DEUT DE HH 215

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