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December 2010

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Subject:
From:
John Goulet <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Tue, 7 Dec 2010 18:47:23 +0000
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The con would be that you can't get flux on the leads when they are under the connector orunder the body of a power module or relay. 

A flux bottle with a small dispense needle is usually the best solution to get the flux where you need it on the component side. 

A flux pen is used on the leads of a new part to be installed and on the PTh hole on the lead side. 

 Cleaning is required anytime you can't be sure all the flux wasn't heated to burn off the activators. 

 3M makes a great flux remover that works for WS flux and will remove the No-clean flux from under a component and not discolor any adjacent  No-clean flux. 



----- Original Message ----- 
From: "Ioan Tempea" <[log in to unmask]> 
To: [log in to unmask] 
Sent: Tuesday, December 7, 2010 10:01:33 AM 
Subject: [TN] Gel vs liquid flux 

Dear Technos, 

  

What would be the cons against eliminating the use of liquid flux for rework and repairs and only using gel flux instead? I'm talking both WS and no-clean. 

  

Thanks, 

  

Ioan Tempea, ing. 
Ingénieur Principal de Fabrication / Senior Manufacturing Engineer 
T | 450.967.7100 ext.244 
E | [log in to unmask] <mailto:[log in to unmask]>   
W | www.digico.cc <http://www.digico.cc/> 

  
 N'imprimer que si nécessaire - Print only if you must 

  


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