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Subject:
From:
Jonathan Galaska <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Jonathan Galaska <[log in to unmask]>
Date:
Sun, 5 Dec 2010 15:37:48 -0500
Content-Type:
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text/plain (209 lines)
Hi Leland, I have not seen any data on vibration specifically. The most
common reason for using corner bond is to increase reliability for drop
testing. I have seen occasions where drop tests went from less than a
50% passing rate to 100% with the corner bond in place. The secondary
benefit is higher reliability after thermal shock.

We do not have any data cleared for sharing publically regarding
light-curable adhesives just yet. The Henkel guys published a good paper
demonstrating  quantitative benefits of corner bond and re-reflow
application epoxy materials, "Processing and reliability of corner
bonded CSPs." It is available online through ieee.org.

Jon Galaska
Dymax


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Leland Woodall
Sent: Friday, December 03, 2010 1:56 PM
To: [log in to unmask]
Subject: Re: [TN] Component corner bonding

Will corner bonding a BGA prevent the issue I discussed yesterday?  If
so, have any studies been conducted to conclude it will provide X%
better reliability?

Leland

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Jonathan Galaska
Sent: Friday, December 03, 2010 11:53 AM
To: [log in to unmask]
Subject: Re: [TN] Component corner bonding

Hi Genny, There are various different adhesive technologies available
for corner bonding. One of the newer technologies is light-curable
adhesives. They are applied to the board post-reflow and cured in
seconds. Flow is engineered to wet the edge of the component while
minimizing flow underneath. This is important for BGAs where the outside
edge of balls can be very close to the edge of the BGA. It's also needed
ensure all material gets exposed to light and cures. If fast process
speed is critical for the application, this technology may be worth a
look. More information is available here:

http://www.dymax.com/pdf/literature/lit244_leadless_component_ruggedizat
ion_sell_sheet.pdf

The most common one we have is 9422-SC. It's readily available, we can
ship a few sample syringes immediately if desired.

Jon Galaska
Dymax

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-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Gary Bremer
Sent: Friday, December 03, 2010 10:55 AM
To: [log in to unmask]
Subject: Re: [TN] Component corner bonding

We use 3M(tm) Scotch-Weld(tm) Epoxy Adhesive EC-2216 A/B

Gary Bremer

Hardware Quality

"And can the liberties of a nation be thought secure when we have
removed their only firm basis, a conviction in the minds of the people
that these liberties are the gift of God? That they are not to be
violated but with his wrath? Indeed I tremble for my country when I
reflect that God is just: that his justice cannot sleep for ever."
--Thomas Jefferson, Notes on the State of Virginia, Query 18, 1781
    




> Date: Fri, 3 Dec 2010 09:41:25 -0600
> From: [log in to unmask]
> Subject: [TN] Component corner bonding
> To: [log in to unmask]
> 
> Can anyone suggest any materials they use for corner bonding a BGA?
> Looking for specific manufacturer brand/part numbers, preferably
> something that is available immediately if not sooner.
> We seem to have misplaced our stock we thought we had, and need some
> desperately and it has a 7 week lead time...
> 
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