Hello Technetters,
 
Received a customer return showing QFN package cracking after double
sided reflow on a board with coax connectors near the package.  Board
shows a lot of thermal mass on one side. Do not have the details of
solder material and reflow  profile. I have posted a .PDF file of images
on the following link. Please go to the file tab , not photos. Your
comments/feedback will be appreciated. 
 
 
http://ipc-technet.groupsite.com/main/summary
<http://ipc-technet.groupsite.com/main/summary> 
 
 
 
Thank-you, Mumtaz
 

Mumtaz Bora

Senior Packaging Engineer

Peregrine Semiconductor

9380 Carroll Park Drive

San Diego, CA 92121

858-795-0112-direct

858-731-9499 -fax

[log in to unmask]

 

 

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