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Subject:
From:
Victor Hernandez <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Fri, 3 Dec 2010 13:36:58 -0600
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At one time with conducted a flat section on the BGA to expose the chip bumps for continuity testing of the isolated net.   After that the flat section continues onto the device carrier and repeat testing with curve tracer.

"X"

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Paul Edwards
Sent: Friday, December 03, 2010 12:59 PM
To: [log in to unmask]
Subject: Re: [TN] BGA Failure Analysis Recommendations

Leland,

I assume that when you mean Y-direction you are saying the displacement is in the z-axis of the BGA...

Paul

Paul Edwards
Surface Art Engineering


-----Original Message-----
From: Leland Woodall [mailto:[log in to unmask]] 
Sent: Thursday, December 02, 2010 1:45 PM
To: TechNet E-Mail Forum; Paul Edwards
Subject: RE: [TN] BGA Failure Analysis Recommendations

Paul,

The unit that failed was being tested in the Y-direction at a sweep from
20 to 200 Hertz.

Leland

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Paul Edwards
Sent: Thursday, December 02, 2010 3:16 PM
To: [log in to unmask]
Subject: Re: [TN] BGA Failure Analysis Recommendations

Which direction was the vibration induced and at what frequency?

Paul

Paul Edwards
Surface Art Engineering


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Leland Woodall
Sent: Thursday, December 02, 2010 11:54 AM
To: [log in to unmask]
Subject: Re: [TN] BGA Failure Analysis Recommendations

Werner,

Actually the assembly failed a multi-cycle vibration test.  The test
details were developed by a team of the customer's design and our R&D
group.  The test itself is supposed to reflect a worst-case scenario of
10 years of product usage.

Leland

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Werner Engelmaier
Sent: Thursday, December 02, 2010 2:13 PM
To: [log in to unmask]
Subject: Re: [TN] BGA Failure Analysis Recommendations


 Hi Leland,
Most HALT tests are NOT accelerated reliability tests-the first tests
for robustness and for the second you should follow IPC-9701.
Werner

 


 

 

-----Original Message-----
From: Leland Woodall <[log in to unmask]>
To: [log in to unmask]
Sent: Thu, Dec 2, 2010 11:01 am
Subject: Re: [TN] BGA Failure Analysis Recommendations


Richard,



We've priced but not yet purchased a BGA inspection scope.  I'll check

the one you've mentioned below from Practical.  It might be thousands

cheaper than what we're considering, and yet perform the same function.



As far as the component, it was not reworked.  The unit passed all our

in-house testing before being submitted to our HALT process.



The board finish is OSP.



Leland



-----Original Message-----

From: Stadem, Richard D. [mailto:[log in to unmask]] 

Sent: Thursday, December 02, 2010 10:57 AM

To: TechNet E-Mail Forum; Leland Woodall

Subject: RE: BGA Failure Analysis Recommendations



Or you have an internal via barrel crack. 

One way to tell is to purchase the small inspection prisms from

Practical Components. No BGA assembler/inspector should be without one.

You can use any standard microscope and the inspection mirror to see

under almost any BGA. The prism has a beveled edge so you can get right

down to the PWB, and you can angle the mirror to obtain the best view.

The prism is mounted on the end of a small wire that goes into a handle

much like an exacto knife handle. Imagine a 9-iron with a highly

polished face, but in miniature. To use it, you only need about .070"

clearance around the BGA periphery.



Back to the cause of the intermittent open. 

If the BGA was previously reworked, and this did not fix the issue, then

it is probably an internal via separation. These are quite often

mistaken for a bad BGA solder connection. If it is a solder joint issue,

it is usually either BP or BF.

What is the circuit board finish?



-----Original Message-----

From: TechNet [mailto:[log in to unmask]] On Behalf Of Leland Woodall

Sent: Thursday, December 02, 2010 9:36 AM

To: [log in to unmask]

Subject: [TN] BGA Failure Analysis Recommendations



Good morning, everyone!



I'm looking for some advice on how to best analyze a BGA problem.  We

had an assembly to fail in a reliability test, and have isolated the

problem to an intermittent contact on the BGA device.  When downward

pressure is applied to the component it will pass.  Without the

pressure, it won't.



That tells me we have either fractured a joint, had a ball to separate

from the package, or had a head in pillow (or non-wet) condition.



We don't have a BGA inspection scope in house, and I can only see two of

the four outside edges with the equipment I have.  Of course, nothing is

wrong with those.



We have both 2 and 3D xray machines, but neither detect a flawed

condition.



At this point, do I go with dye and pry, or conduct a series of cross

sections?



What's the recommendations of the pros out there that have dealt with

this?  Your suggestions are sincerely appreciated!



Leland Woodall



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