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December 2010

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Subject:
From:
vladimir Igoshev <[log in to unmask]>
Reply To:
Date:
Thu, 2 Dec 2010 21:11:51 +0000
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Stewart,

I don't think that sectioning is always the way to go, particularly if there is a case of Hop. If X-ray shows it, then I'd usually pull-off the BGA and do SEM/EDS on the head and pillow. It gives much more information than just sectioning.
Vladimir

SENTEC Testing Laboratory Inc.
11 Canadian Road, Unit 7.
Scarborough, ON M1R 5G1
Tel: (416) 899-1882
Fax: (905) 882-8812
www.sentec.ca

-----Original Message-----
From: Stewart McCracken <[log in to unmask]>
Sender: TechNet <[log in to unmask]>
Date:         Thu, 2 Dec 2010 20:03:05 
To: <[log in to unmask]>
Reply-To: TechNet E-Mail Forum <[log in to unmask]>,
        Stewart McCracken <[log in to unmask]>
Subject: Re: [TN] BGA Failure Analysis Recommendations

Which is another good reason to micro-section. Seriously though, if you are looking for root-cause, the last thing you want is uncertainty. X-ray is great as a supporting tool, but IMHO, often not the tool to allow conclusive root-cause to be identified. No matter how well resolved (or not), x-ray will never give you the materials (and indirectly) processing information which micro-section analysis does. One of the best points in favour of micro-section is the definitive nature of the output. If there is a failure to form (HIP or similar) or failure of a joint which initially formed (fracture through IMC or solder), and assuming that the micro-section is prepared and inspected correctly, you WILL find it with micro-section. 

Kind regards,

Stewart

Stewart McCracken
MCS Ltd.
Centre House
Midlothian Innovation Centre
Roslin
Midlothian
EH25 9RE
 
m. +44(0)7711 541735 
t.   +44(0)131 440 9090
f.   +44(0)131 440 9085
e.  [log in to unmask]
w. www.themcsgroup.co.uk



  

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Whittaker, Dewey (EHCOE)
Sent: 02 December 2010 19:50
To: [log in to unmask]
Subject: [TN] FW: [TN] BGA Failure Analysis Recommendations

Actually, it just needs to be open to interpretation.
Dewey

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of vladimir Igoshev
Sent: Thursday, December 02, 2010 12:40 PM
To: [log in to unmask]
Subject: Re: [TN] BGA Failure Analysis Recommendations

And the crack has to be rather wide-open
Vladimir

SENTEC Testing Laboratory Inc.
11 Canadian Road, Unit 7.
Scarborough, ON M1R 5G1
Tel: (416) 899-1882
Fax: (905) 882-8812
www.sentec.ca

-----Original Message-----
From: Werner Engelmaier <[log in to unmask]>
Sender: TechNet <[log in to unmask]>
Date:         Thu, 2 Dec 2010 14:20:31 
To: <[log in to unmask]>
Reply-To: TechNet E-Mail Forum <[log in to unmask]>,
        Werner Engelmaier <[log in to unmask]>
Subject: Re: [TN] BGA Failure Analysis Recommendations

 Yes, Bob, you are.
SJ cracks/fractures, brittle or otherwise, cannot be seen with the
typical X-ray machine. However, there are X-ray machines out there that
can look at individual SJs and can see fracture-this is rather
time-consuming, though.
Werner

 


 

 

-----Original Message-----
From: Robert Kondner <[log in to unmask]>
To: [log in to unmask]
Sent: Thu, Dec 2, 2010 11:54 am
Subject: Re: [TN] BGA Failure Analysis Recommendations


Hi,



 I am very interested in how this turns out.



 Here we have a known problem at a known location and neither 2D or 3D
X-Ray

show the error. Did I get that right?



 This makes me question X-Ray inspection as a general inspection method.
If

you have a blob of solder under a part sure. But opens seem to be an
issue?



 Am I overly critical of X- Ray here?



Thanks,

Bob K.



-----Original Message-----

From: TechNet [mailto:[log in to unmask]] On Behalf Of Leland Woodall

Sent: Thursday, December 02, 2010 10:36 AM

To: [log in to unmask]

Subject: [TN] BGA Failure Analysis Recommendations



Good morning, everyone!



I'm looking for some advice on how to best analyze a BGA problem.  We
had an

assembly to fail in a reliability test, and have isolated the problem to
an

intermittent contact on the BGA device.  When downward pressure is
applied

to the component it will pass.  Without the pressure, it won't.



That tells me we have either fractured a joint, had a ball to separate
from

the package, or had a head in pillow (or non-wet) condition.



We don't have a BGA inspection scope in house, and I can only see two of
the

four outside edges with the equipment I have.  Of course, nothing is
wrong

with those.



We have both 2 and 3D xray machines, but neither detect a flawed
condition.



At this point, do I go with dye and pry, or conduct a series of cross

sections?



What's the recommendations of the pros out there that have dealt with
this?

Your suggestions are sincerely appreciated!



Leland Woodall



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