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December 2010

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From:
vladimir Igoshev <[log in to unmask]>
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Date:
Thu, 2 Dec 2010 19:39:56 +0000
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And the crack has to be rather wide-open
Vladimir

SENTEC Testing Laboratory Inc.
11 Canadian Road, Unit 7.
Scarborough, ON M1R 5G1
Tel: (416) 899-1882
Fax: (905) 882-8812
www.sentec.ca

-----Original Message-----
From: Werner Engelmaier <[log in to unmask]>
Sender: TechNet <[log in to unmask]>
Date:         Thu, 2 Dec 2010 14:20:31 
To: <[log in to unmask]>
Reply-To: TechNet E-Mail Forum <[log in to unmask]>,
        Werner Engelmaier <[log in to unmask]>
Subject: Re: [TN] BGA Failure Analysis Recommendations

 Yes, Bob, you are.
SJ cracks/fractures, brittle or otherwise, cannot be seen with the typical X-ray machine. However, there are X-ray machines out there that can look at individual SJs and can see fracture—this is rather time-consuming, though.
Werner

 


 

 

-----Original Message-----
From: Robert Kondner <[log in to unmask]>
To: [log in to unmask]
Sent: Thu, Dec 2, 2010 11:54 am
Subject: Re: [TN] BGA Failure Analysis Recommendations


Hi,



 I am very interested in how this turns out.



 Here we have a known problem at a known location and neither 2D or 3D X-Ray

show the error. Did I get that right?



 This makes me question X-Ray inspection as a general inspection method. If

you have a blob of solder under a part sure. But opens seem to be an issue?



 Am I overly critical of X- Ray here?



Thanks,

Bob K.



-----Original Message-----

From: TechNet [mailto:[log in to unmask]] On Behalf Of Leland Woodall

Sent: Thursday, December 02, 2010 10:36 AM

To: [log in to unmask]

Subject: [TN] BGA Failure Analysis Recommendations



Good morning, everyone!



I'm looking for some advice on how to best analyze a BGA problem.  We had an

assembly to fail in a reliability test, and have isolated the problem to an

intermittent contact on the BGA device.  When downward pressure is applied

to the component it will pass.  Without the pressure, it won't.



That tells me we have either fractured a joint, had a ball to separate from

the package, or had a head in pillow (or non-wet) condition.



We don't have a BGA inspection scope in house, and I can only see two of the

four outside edges with the equipment I have.  Of course, nothing is wrong

with those.



We have both 2 and 3D xray machines, but neither detect a flawed condition.



At this point, do I go with dye and pry, or conduct a series of cross

sections?



What's the recommendations of the pros out there that have dealt with this?

Your suggestions are sincerely appreciated!



Leland Woodall



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