Dave,
Thank you.
In my experience with ICT programming it has always been the "Opens" that
were difficult to identify so I tend to concentrate on open failures.
I buy the argument that not one technique is sufficient to detect a broad
range of issues. But, since no level of inspection will ever replace a good
process I am left with trying to decide which types of inspection/process is
appropriate for a given part style for a given PCB finish. Also, I am
thinking that inspection should help qualify the process and not just as a
connection verification of specific pins on specific components.
As a circuit designer I wish to select component styles (when I have a
chance) and PCB finishes (here I have a choice) that will fit into whatever
assembly and inspection process my CM eventually uses. X-Ray seems to be the
most common advanced inspection technique that I find in use though there
are many variations.
Is there any difference in how various PCB finishes will influence how well
X-Ray techniques reveal opens or qualify the assembly process?
Thanks Again,
Bob K.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of David D. Hillman
Sent: Thursday, December 02, 2010 12:20 PM
To: [log in to unmask]
Subject: Re: [TN] BGA Failure Analysis Recommendations
Hi Bob - maybe just a bit. Today's Xray systems can do some outstanding
assessments but there are some cracks/wetting conditions that a
cross-section is the optimum way of assessment. I think you have touch on
more of a level of expectation versus technique capability for a given
analysis method.
Dave
Robert Kondner <[log in to unmask]> Sent by: TechNet
<[log in to unmask]>
12/02/2010 10:54 AM
Please respond to
[log in to unmask]
To
[log in to unmask]
cc
Subject
Re: [TN] BGA Failure Analysis Recommendations
Hi,
I am very interested in how this turns out.
Here we have a known problem at a known location and neither 2D or 3D
X-Ray
show the error. Did I get that right?
This makes me question X-Ray inspection as a general inspection method.
If
you have a blob of solder under a part sure. But opens seem to be an
issue?
Am I overly critical of X- Ray here?
Thanks,
Bob K.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Leland Woodall
Sent: Thursday, December 02, 2010 10:36 AM
To: [log in to unmask]
Subject: [TN] BGA Failure Analysis Recommendations
Good morning, everyone!
I'm looking for some advice on how to best analyze a BGA problem. We had
an
assembly to fail in a reliability test, and have isolated the problem to
an
intermittent contact on the BGA device. When downward pressure is applied
to the component it will pass. Without the pressure, it won't.
That tells me we have either fractured a joint, had a ball to separate
from
the package, or had a head in pillow (or non-wet) condition.
We don't have a BGA inspection scope in house, and I can only see two of
the
four outside edges with the equipment I have. Of course, nothing is wrong
with those.
We have both 2 and 3D xray machines, but neither detect a flawed
condition.
At this point, do I go with dye and pry, or conduct a series of cross
sections?
What's the recommendations of the pros out there that have dealt with
this?
Your suggestions are sincerely appreciated!
Leland Woodall
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