You ought to see how Southern California handles ANY type of weather. You would think we are made of rice paper and the world is coming to an end whenever we get a little rain fall (and we drive just as bad - too fast for the conditions). One rainy morning I counted six cars involved in single car accidents (spin outs) with very confused drivers with a "deer in the headlights" look wondering how they ended up on the side of the road facing traffic no longer going with traffic.
Our weather reporting is completely overkill for our conditions - Doppler radar to catch the intensity of the rain when it does show up. With a typical 5 degree (F) differential between the coast and inland areas our weather reports are a huge waste of time, with the exception of the occasional mountain pass road closures due to snow.
Every time it rains they send reporters and cameras to catch the action of moving water. It's embarrassing to those who understand what real weather is. That all said, I must say we have the best looking weather reporters (though wonder what they actually know beyond their teleprompters tell them to say). Born, raised and still in SoCal so I can mock us without any biases, and we deserve to be mocked every now and then as we take ourselves way too seriously as we actually think Hollywood makes important contributions beyond entertainment. I will now get off my weathered soapbox!
Gregg Owens | Technical Writer
Wavestream Corporation
(909) 451-6089 | [log in to unmask]
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Joyce Koo
Sent: Friday, December 17, 2010 9:12 AM
To: [log in to unmask]
Subject: Re: [TN] NTC [TN] X-ray inspection of voids under chip caps and resistors
No wonder your guys using weather as the main topic as part of greeting everyday.
--------------------------
Sent using BlackBerry
----- Original Message -----
From: Mike Fenner [mailto:[log in to unmask]]
Sent: Friday, December 17, 2010 12:07 PM
To: [log in to unmask] <[log in to unmask]>
Subject: Re: [TN] NTC [TN] X-ray inspection of voids under chip caps and resistors
I have to respond!
Last year when we were again brought to a halt by Snow, The Times newspaper
did a survey of Moscow, Stockholm, Oslo etc, all the Cities where they get
snow every year and apparently cope.
What they found was that every where the first few days of snow was always a
surprise and seemingly chaotic, then they cope. So the comparison you are
getting is London in the first few days versus everywhere in their normal
condition. Of course we then revert to our normal which is no snow, but
there's no story in "no snow everything working".
Also the Brit media covers this sort of thing extensively and being in
English, makes cheap copy for your news (with a US voice over), presumably
on the lines of "Bumbling Brits". Similarly we often get more coverage of US
events than the news content really justifies, usually on the lines of "Only
in America".
Graham's golf is something else.
Regards
Mike
ü Please consider the environment before printing this e-mail
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Whittaker, Dewey (EHCOE)
Sent: Thursday, December 16, 2010 2:34 PM
To: [log in to unmask]
Subject: Re: [TN] NTC [TN] X-ray inspection of voids under chip caps and
resistors
Look what happens to London when they get major snow; although they
admirably try, everything generally comes to a halt. Except for Graham; with
his golf game he is used to driving in the rough.
Balmy and Sunny (81º F) in Scottsdale
Dewey
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Stadem, Richard D.
Sent: Thursday, December 16, 2010 7:10 AM
To: [log in to unmask]
Subject: Re: [TN] NTC [TN] X-ray inspection of voids under chip caps and
resistors
Everywhere there is significant regular snowfall, there is some experience
and preparation for driving in it, at least for a large part of the local
population. And even here we all marvel at the complete idiots such as the
person I saw last week who passed me while eating a roll, talking on a
cellphone, and drinking coffee all at the same time while there was only two
small ruts in the ice in each lane to drive in. After passing me, this
person spun out aways ahead of me and crashed into both barriers on each
side of the road, bouncing back and forth like a ping-pong ball. I stopped
to help, and you know what this person said after getting out of the car?
"Why does stuff like this happen to me?"
For Singapore or any other major city not used to snow, to have a major
snowstorm would be catastrophic.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Joyce Koo
Sent: Thursday, December 16, 2010 12:53 AM
To: [log in to unmask]
Subject: Re: [TN] NTC [TN] X-ray inspection of voids under chip caps and
resistors
Without snow tires on your car like in your neck of woods, you don't want
snow. Believe me.
--------------------------
Sent using BlackBerry
----- Original Message -----
From: Ong Seet Leng [mailto:[log in to unmask]]
Sent: Thursday, December 16, 2010 01:40 AM
To: [log in to unmask] <[log in to unmask]>
Subject: Re: [TN] NTC [TN] X-ray inspection of voids under chip caps and
resistors
How I wish there is snow in Singapore.
Regards,
Seet Leng
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Brian Ellis
Sent: Thursday, December 16, 2010 2:35 PM
To: [log in to unmask]
Subject: Re: [TN] NTC [TN] X-ray inspection of voids under chip caps and
resistors
It snowed in the mountains this week; you're too late. :-)
http://famagusta-gazette.com/cold-snap-hits-cyprus-as-snow-falls-p11082-69.h
tm
You can see in the photo the bottom end of one of the ski lifts.
Brian
On 15/12/2010 19:31, Stadem, Richard D. wrote:
> LOL! Pretty soon it will snow in Cyprus as well!
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Joyce Koo
> Sent: Wednesday, December 15, 2010 11:28 AM
> To: [log in to unmask]
> Subject: Re: [TN] NTC [TN] X-ray inspection of voids under chip caps and
resistors
>
> Is that why the sky opened up to provide with them sufficient sample size
for statistic validation few days ago?
> --------------------------
> Sent using BlackBerry
>
>
> ----- Original Message -----
> From: Werner Engelmaier [mailto:[log in to unmask]]
> Sent: Wednesday, December 15, 2010 10:29 AM
> To: [log in to unmask]<[log in to unmask]>
> Subject: Re: [TN] NTC [TN] X-ray inspection of voids under chip caps and
resistors
>
> Steve,
> What me joking about the EU-anybody who can mindlessly ban Pb from solder,
certainly can regulate banana curvature-I am hearing the size of snowflakes
is next [now that is a joke]
> Werner
>
>
>
>
>
>
>
>
> -----Original Message-----
> From: Steve Gregory<[log in to unmask]>
> To: 'TechNet E-Mail Forum'<[log in to unmask]>; 'Werner
Engelmaier'<[log in to unmask]>
> Sent: Wed, Dec 15, 2010 9:43 am
> Subject: RE: NTC [TN] X-ray inspection of voids under chip caps and
resistors
>
>
> Werner, I thought you were just making a joke about "the EU specifying the
>
> allowable curvature of bananas", but you weren't!
>
>
>
> http://tinyurl.com/y9t8lr3
>
>
>
> Geeze...don't know what to say. Can't believe that there's actually a
>
> quality standard written for bananas
>
>
>
> Steve
>
>
>
> -----Original Message-----
>
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Werner Engelmaier
>
> Sent: Wednesday, December 15, 2010 8:24 AM
>
> To: [log in to unmask]
>
> Subject: Re: [TN] X-ray inspection of voids under chip caps and resistors
>
>
>
> Hi Phil,
>
> It is an old story---just because you can measure something---even with,
or
>
> maybe because of very expensive equipment, does not make it necessarily
>
> significant or important. It has been shown over and over again, that
voids
>
> in the normally produced ranges have no negative [there is actually a
slight
>
> positive effect under some limited special conditions] reliability impact.
>
> It is like the EU specifying the allowable curvature of bananas.
>
> Werner
>
>
>
>
>
>
>
>
>
>
>
>
>
> -----Original Message-----
>
> From: David D. Hillman<[log in to unmask]>
>
> To: [log in to unmask]
>
> Sent: Wed, Dec 15, 2010 8:11 am
>
> Subject: Re: [TN] X-ray inspection of voids under chip caps and resistors
>
>
>
>
>
> Hi Phil - There are a number of X-ray systems on the market that can
>
>
>
> accomplish the task per the NASA Workmanship standards but the question
>
>
>
> really should be "why is there such a requirement?". Rockwell Collins,
>
>
>
> RIM, Indium and Dage are finishing up a BGA voiding study that shows voids
>
>
>
> are not a "primary" issue to solder joint integrity. We will be proposing
>
>
>
> to the JSTD-001 committee new BGA voiding requirements, in collaboration
>
>
>
> with a number of other industry investigators, at the IPC 2011 Fall
>
>
>
> meeting. I find it a bit hard to believe that a chip resistor needs a
>
>
>
> stricter solder joint void requirement than a BGA component.
>
>
>
>
>
>
>
> Dave Hillman
>
>
>
> Rockwell Collins
>
>
>
> [log in to unmask]
>
>
>
>
>
>
>
>
>
>
>
>
>
>
>
> Phil Bavaro<[log in to unmask]>
>
>
>
> Sent by: TechNet<[log in to unmask]>
>
>
>
> 12/14/2010 06:06 PM
>
>
>
> Please respond to
>
>
>
> TechNet E-Mail Forum<[log in to unmask]>; Please respond to
>
>
>
> [log in to unmask]
>
>
>
>
>
>
>
>
>
>
>
> To
>
>
>
> [log in to unmask]
>
>
>
> cc
>
>
>
>
>
>
>
> Subject
>
>
>
> [TN] Xray inspection of voids under chip caps and resistors
>
>
>
>
>
>
>
>
>
>
>
>
>
>
>
>
>
>
>
>
>
>
>
>
>
>
>
> Are any Technetters working with the newly drafted Workmanship standard
>
>
>
> (WSF 11122010) from NASA?
>
>
>
>
>
>
>
> I am surprised that they are intending to implement xray inspection of
>
>
>
> voiding on chip caps and resistors.
>
>
>
>
>
>
>
> It appears they want us to determine the percentage of voids greater
>
>
>
> than 1 mil and then add up the areas both for the beneath component and
>
>
>
> then the external fillets.
>
>
>
>
>
>
>
> While I suppose it is progress to have NASA embracing water soluble
>
>
>
> fluxes, this seems like a huge hurdle to have to cross first.
>
>
>
>
>
>
>
>
>
>
>
>
>
>
>
> Here is the requirement as drafted:
>
>
>
>
>
>
>
>
>
>
>
>
>
>
>
> 1. The X-ray process (including equipment, operator and procedure)
>
>
>
> shall be capable of discerning a solder void that is one thousandth of
>
>
>
> an inch (0.001") in diameter. If the supplier's X-ray capability is not
>
>
>
> adequate, specimens can be sent to GSFC for X-ray.
>
>
>
>
>
>
>
> 2. For each PWA or coupon examined via X-ray, five worst case
>
>
>
> examples on the PWA or coupon shall be selected for measurement to show
>
>
>
> compliance with the following criteria:
>
>
>
>
>
>
>
> a. For parts with chip package styles (e.g. resistors, diodes,
>
>
>
> capacitors) and for flatpacks, a minimum of 75% of the solderable area
>
>
>
> directly under the end cap or lap portion of the lead shall be
>
>
>
> filled/wetted (i.e., using the solderable area under the end cap or lead
>
>
>
> as the denominator and that area less all absences of solder - voids,
>
>
>
> areas where the solder did not wet, overhangs due to misregistration,
>
>
>
> etc. - as the numerator). This requirement applies only to the area
>
>
>
> directly underneath the end cap (chip packages) and lap portion of the
>
>
>
> lead (flatpacks), and does not apply to other package styles and does
>
>
>
> not include any portion of the fillet.
>
>
>
>
>
>
>
> b. For all package styles, the void area in the fillet area shall
>
>
>
> include only those areas that are completely enclosed with solder, and
>
>
>
> shall not exceed 10% of the area covered by the fillet.
>
>
>
>
>
>
>
>
>
>
>
>
>
>
>
> I know that some xray systems have pretty helpful software packages for
>
>
>
> void detection, but I don't remember any that looked at solder
>
>
>
> percentages beneath the component versus fillet versus both.
>
>
>
>
>
>
>
>
>
>
>
>
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>
>
>
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>
>
>
>
>
>
>
>
>
>
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