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December 2010

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Subject:
Re: NTC [TN] X-ray inspection of voids under chip caps and resistors
From:
Ioan Tempea <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Ioan Tempea <[log in to unmask]>
Date:
Thu, 16 Dec 2010 07:47:10 -0500
Content-Type:
text/plain
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You know what? Try shovelling sand for 15 minutes each day, 6 months a year, and then give it a second thought ;-)

Ioan Tempea, ing.
Ingénieur Principal de Fabrication / Senior Manufacturing Engineer
T | 450.967.7100 ext.244
E | [log in to unmask] 
W | www.digico.cc

N’imprimer que si nécessaire – Print only if you must

-----Message d'origine-----
De : Ong Seet Leng [mailto:[log in to unmask]] 
Envoyé : December-16-10 1:41 AM
À : [log in to unmask]
Objet : Re: [TN] NTC [TN] X-ray inspection of voids under chip caps and resistors

How I wish there is snow in Singapore.

Regards,
Seet Leng


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