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December 2010

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Subject:
From:
Joyce Koo <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Joyce Koo <[log in to unmask]>
Date:
Thu, 16 Dec 2010 01:53:19 -0500
Content-Type:
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Without snow tires on your car like in your neck of woods, you don't want snow. Believe me.
--------------------------
Sent using BlackBerry


----- Original Message -----
From: Ong Seet Leng [mailto:[log in to unmask]]
Sent: Thursday, December 16, 2010 01:40 AM
To: [log in to unmask] <[log in to unmask]>
Subject: Re: [TN] NTC [TN] X-ray inspection of voids under chip caps and resistors

How I wish there is snow in Singapore.

Regards,
Seet Leng

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Brian Ellis
Sent: Thursday, December 16, 2010 2:35 PM
To: [log in to unmask]
Subject: Re: [TN] NTC [TN] X-ray inspection of voids under chip caps and resistors

It snowed in the mountains this week; you're too late. :-)
http://famagusta-gazette.com/cold-snap-hits-cyprus-as-snow-falls-p11082-69.htm
You can see in the photo the bottom end of one of the ski lifts.

Brian

On 15/12/2010 19:31, Stadem, Richard D. wrote:
> LOL! Pretty soon it will snow in Cyprus as well!
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Joyce Koo
> Sent: Wednesday, December 15, 2010 11:28 AM
> To: [log in to unmask]
> Subject: Re: [TN] NTC [TN] X-ray inspection of voids under chip caps and resistors
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> Is that why the sky opened up to provide with them sufficient sample size for statistic validation few days ago?
> --------------------------
> Sent using BlackBerry
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>
> ----- Original Message -----
> From: Werner Engelmaier [mailto:[log in to unmask]]
> Sent: Wednesday, December 15, 2010 10:29 AM
> To: [log in to unmask]<[log in to unmask]>
> Subject: Re: [TN] NTC [TN] X-ray inspection of voids under chip caps and resistors
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>   Steve,
> What me joking about the EU—anybody who can mindlessly ban Pb from solder, certainly can regulate banana curvature—I am hearing the size of snowflakes is next [now that is a joke]
> Werner
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> -----Original Message-----
> From: Steve Gregory<[log in to unmask]>
> To: 'TechNet E-Mail Forum'<[log in to unmask]>; 'Werner Engelmaier'<[log in to unmask]>
> Sent: Wed, Dec 15, 2010 9:43 am
> Subject: RE: NTC [TN] X-ray inspection of voids under chip caps and resistors
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> Werner, I thought you were just making a joke about "the EU specifying the
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> allowable curvature of bananas", but you weren't!
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> http://tinyurl.com/y9t8lr3
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> Geeze...don't know what to say. Can't believe that there's actually a
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> quality standard written for bananas
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> Steve
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> -----Original Message-----
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> From: TechNet [mailto:[log in to unmask]] On Behalf Of Werner Engelmaier
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> Sent: Wednesday, December 15, 2010 8:24 AM
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> To: [log in to unmask]
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> Subject: Re: [TN] X-ray inspection of voids under chip caps and resistors
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>   Hi Phil,
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> It is an old story---just because you can measure something---even with, or
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> maybe because of very expensive equipment, does not make it necessarily
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> significant or important. It has been shown over and over again, that voids
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> in the normally produced ranges have no negative [there is actually a slight
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> positive effect under some limited special conditions] reliability impact.
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> It is like the EU specifying the allowable curvature of bananas.
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> Werner
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> -----Original Message-----
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> From: David D. Hillman<[log in to unmask]>
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> To: [log in to unmask]
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> Sent: Wed, Dec 15, 2010 8:11 am
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> Subject: Re: [TN] X-ray inspection of voids under chip caps and resistors
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> Hi Phil - There are a number of X-ray systems on the market that can
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> accomplish the task per the NASA Workmanship standards but the question
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> really should be "why is there such a requirement?". Rockwell Collins,
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> RIM, Indium and Dage are finishing up a BGA voiding study that shows voids
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> are not a "primary" issue to solder joint integrity. We will be proposing
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> to the JSTD-001 committee new BGA voiding requirements, in collaboration
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> with a number of other industry investigators, at the IPC 2011 Fall
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> meeting. I find it a bit hard to believe that a chip resistor needs a
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> stricter solder joint void requirement than a BGA component.
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> Dave Hillman
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> Rockwell Collins
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> [log in to unmask]
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> Phil Bavaro<[log in to unmask]>
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> Sent by: TechNet<[log in to unmask]>
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> 12/14/2010 06:06 PM
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> Please respond to
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> TechNet E-Mail Forum<[log in to unmask]>; Please respond to
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> [log in to unmask]
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> To
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> Subject
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> [TN] Xray inspection of voids under chip caps and resistors
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> Are any Technetters working with the newly drafted Workmanship standard
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> I am surprised that they are intending to implement xray inspection of
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> It appears they want us to determine the percentage of voids greater
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> While I suppose it is progress to have NASA embracing water soluble
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> fluxes, this seems like a huge hurdle to have to cross first.
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> 1.       The X-ray process (including equipment, operator and procedure)
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> shall be capable of discerning a solder void that is one thousandth of
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> an inch (0.001") in diameter.  If the supplier's X-ray capability is not
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> adequate, specimens can be sent to GSFC for X-ray.
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> 2.       For each PWA or coupon examined via X-ray, five worst case
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> examples on the PWA or coupon shall be selected for measurement to show
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> compliance with the following criteria:
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> a.       For parts with chip package styles (e.g. resistors, diodes,
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> capacitors) and for flatpacks, a minimum of 75% of the solderable area
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> directly under the end cap or lap portion of the lead shall be
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> filled/wetted (i.e., using the solderable area under the end cap or lead
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> as the denominator and that area less all absences of solder - voids,
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> areas where the solder did not wet, overhangs due to misregistration,
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> etc. - as the numerator).   This requirement applies only to the area
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> directly underneath the end cap (chip packages) and lap portion of the
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> lead (flatpacks), and does not apply to other package styles and does
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> not include any portion of the fillet.
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> b.       For all package styles, the void area in the fillet area shall
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> shall not exceed 10% of the area covered by the fillet.
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> I know that some xray systems have pretty helpful software packages for
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