Hello TechNetters,
 
I have some wirebonds on a Hi -Rel package that pulled below 2.0 gm
minimum  per Mil -Std -883. I have taken some SEM images of failed and
good bonds. Customer has a concern with plane of fracture of the failed
bonds even though it is break at "neck" . . It is Aluminum wire/to
Aluminum bond pad wedge bonded ultrasonically and aluminum wire to gold
plated post also bonded ultrasonic. Wire pull is post seal. I have
uploaded the file of images on the TechNet groupsite .I will appreciate
some feedback from wirebonding experts on the forum.
 
 http://ipc-technet.groupsite.com/main/summary
<http://ipc-technet.groupsite.com/main/summary> 

Thank-you, Mumtaz

Mumtaz Bora

Senior Packaging Engineer

Peregrine Semiconductor

9380 Carroll Park Drive

San Diego, CA 92121

858-795-0112-direct

858-731-9499 -fax

[log in to unmask]

 

 

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