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Subject:
From:
Steve Gregory <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Steve Gregory <[log in to unmask]>
Date:
Fri, 12 Nov 2010 07:35:03 -0500
Content-Type:
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Hi Bob!

I have Stephan's paper posted here:

http://stevezeva.homestead.com/Meschter_reballing.pdf

Steve

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Bob Landman
Sent: Thursday, November 11, 2010 5:20 PM
To: [log in to unmask]
Subject: Re: [TN] BGA reballing -- ROHS to Lead solder balls

Prashant,

When we considered reballing (before Lattice announced we could get their
latest FPGA with Sn/Pb balls) we researched this question (as we still
refuse to use lead-free solder).  Here's what I learned:

1)  paper on reballing study from Steph Meschter at BAE Systems (sent to
Steve G to post)

2)  contact [log in to unmask] to obtain the preliminary results they
had from the NAVY SBIR they did last year.

3)  Martin reballer equipment www.martin-smt.de

4)  paper on reballing BGA reliability
http://www.circuitmart.com/pdf/reliability_assessment_reballed_bgas.pdf
which concludes 

"It was therefore inferred that the re-balled components exhibited adequate
performance without any degradation and can serve as a solution for such a
'mixed' system. "

5)  www.retronixcertified.com  reballing in Mexico or Scotland 

6)  http://www.isipkg.com/bga_reballing.php reballing

7)  Jim Carrigan @ Premier Semiconductor Services LLC, 480-736-1970 X16 /
480-736-1188 Fax / www.premiers2.com (reballing)

Bob Landman
H&L Instruments, LLC
www.hlinstruments.com
LDF Coatings, LLC
www.ldfcoatings.com

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of prashant chopra
Sent: Thursday, November 11, 2010 5:52 AM
To: [log in to unmask]
Subject: [TN] BGA reballing -- ROHS to Lead solder balls

Hi,
 
We are having a ROHS BGA which we want to use in the Non-ROHS (leaded)
process. We are looking at option of having the BGA reballed. We would have
the ROHS solder balls removed and replaced with the Non-ROHS solder balls. 
 
I need help to know what can be the technical risks in using these BGA?
Also, what can be the risk and issues associated with this reballing
process?
 
Also, what are the critical precautions, checks and tests which should be
done after the reballing of the BGA before we use them on the PWB?
 
Thanks to all for the support and advice.
 
Rgds
prashant


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