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Subject:
From:
"David D. Hillman" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Thu, 11 Nov 2010 15:38:34 -0600
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Hi Prashant - the items  of concern for the reballing operations would be: 
1) temperature control of the deballing and reballing procedures; 2) 
moisture levels/control of the BGA component; 3) cleanliness control of 
the procedure in terms of ionic residues from the solder processes; 4) ESD 
control; 5) physical damage control in terms of pad damage and soldermask 
damage.


Dave Hillman
Rockwell Collins
[log in to unmask]




prashant chopra <[log in to unmask]> 
Sent by: TechNet <[log in to unmask]>
11/11/2010 04:52 AM
Please respond to
TechNet E-Mail Forum <[log in to unmask]>; Please respond to
prashant chopra <[log in to unmask]>


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Subject
[TN] BGA reballing -- ROHS to Lead solder balls






Hi,
 
We are having a ROHS BGA which we want to use in the Non-ROHS (leaded) 
process. We are looking at option of having the BGA reballed. We would 
have the ROHS solder balls removed and replaced with the Non-ROHS solder 
balls. 
 
I need help to know what can be the technical risks in using these BGA? 
Also, what can be the risk and issues associated with this reballing 
process?
 
Also, what are the critical precautions, checks and tests which should be 
done after the reballing of the BGA before we use them on the PWB?
 
Thanks to all for the support and advice.
 
Rgds
prashant


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