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November 2010

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Subject:
From:
Joyce Koo <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Joyce Koo <[log in to unmask]>
Date:
Tue, 2 Nov 2010 08:34:43 -0400
Content-Type:
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Better coverage?
--------------------------
Sent using BlackBerry


----- Original Message -----
From: Werner Engelmaier [mailto:[log in to unmask]]
Sent: Tuesday, November 02, 2010 08:11 AM
To: [log in to unmask] <[log in to unmask]>
Subject: Re: [TN] Query on Copper plating

 Hi Uppina,
While there is no data on this, there is no reason to expect any real difference as far a reliability is concerned.

 This E-flash neither has the physical properties nor is it thick enough to make any difference.
Werner


 

 

-----Original Message-----
From: Uppina Nagaraj <[log in to unmask]>
To: [log in to unmask]
Sent: Tue, Nov 2, 2010 12:16 am
Subject: [TN] Query on Copper plating


Hi All,



We have a low build electroless Copper plating for Through Hole

metalization, which's giving around 0.5 to 0.6microns of Copper.



The subsequent processes are pattern image printing followed by

pattern plating (electrolytic copper plating).



One of our customer has a requirement to do flash Copper plating

(electro plating) of around 8 to 10 microns, immediately after

electroless Copper plating, prior to pattern image printing.



I want some inputs on the above.....



Is there a distinct advantage on PTH reliability by having

8-10microns of electroplated copper immediately after

electroless Copper plating.



Will having additional flash plating have better Thermal

stress & Thermal Shock performance.



Thanks!

U.Nagaraj







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