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November 2010

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Subject:
From:
prashant chopra <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, prashant chopra <[log in to unmask]>
Date:
Thu, 11 Nov 2010 16:22:25 +0530
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Hi,
 
We are having a ROHS BGA which we want to use in the Non-ROHS (leaded) process. We are looking at option of having the BGA reballed. We would have the ROHS solder balls removed and replaced with the Non-ROHS solder balls. 
 
I need help to know what can be the technical risks in using these BGA? Also, what can be the risk and issues associated with this reballing process?
 
Also, what are the critical precautions, checks and tests which should be done after the reballing of the BGA before we use them on the PWB?
 
Thanks to all for the support and advice.
 
Rgds
prashant


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