Agree. If you need to rework 3 times before get yield up to reasonable %, you can forget the std. Nothing can save you there.
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----- Original Message -----
From: Wolfgang Erat [mailto:[log in to unmask]]
Sent: Wednesday, November 10, 2010 09:47 PM
To: [log in to unmask] <[log in to unmask]>
Subject: Re: [TN] Micro Via Tolerance
The issue is reliability, not size
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----- Original Message -----
From: TechNet <[log in to unmask]>
To: [log in to unmask] <[log in to unmask]>
Sent: Wed Nov 10 21:43:41 2010
Subject: Re: [TN] Micro Via Tolerance
If you really want put into std. Check with Jisso and some of big firm's roadmap. My 2 cents. North America are behind HDI curve. (But may be leading in some flex area. Thx for 3M)
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----- Original Message -----
From: Chris Mahanna [mailto:[log in to unmask]]
Sent: Wednesday, November 10, 2010 09:36 PM
To: [log in to unmask] <[log in to unmask]>
Subject: Re: [TN] Micro Via Tolerance
If you figure out how to measure the diameter and then define this mysterious microvia, call into the next 6012 telecon. It is a hot/contentious topic. We actually had to "parking lot it" for Rev C, to get 'er published.
The most common OEM dimensional requirement is for a target land contact width (dia and positional related), which I believe to be mostly a poorly thought-out "Fix" for poor electroless structural integrity, especially as related to the fabricators first attempts at [non] dedicated lines for Cu fill.
Of course it is also a meaningful parameter for assessment of a fabricator's capability to form said hole.
The problem is conformance assessment, as the required precision of the microsection is difficult if not impossible. IMO, the combination of good electroless and no "hersey kisses" is our best hope for standardization. We are currently working on defining no kisses in 6012, and revamping microsection evaluation for electroless in the microsection task group.
Chris
Chris Mahanna
Robisan Laboratory
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Harner, Chester
Sent: Monday, November 08, 2010 3:49 PM
To: [log in to unmask]
Subject: Re: [TN] Micro Via Tolerance
The Dia Tol was my question.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Thayer, Wayne - IIW
Sent: Monday, November 08, 2010 11:38 AM
To: [log in to unmask]
Subject: Re: [TN] Micro Via Tolerance
Not so fast. Which tolerance are you talking about--positional or hole diameter? I agree that the hole diameter tolerance is basically meaningless for most purposes, but the position tolerance specifies the minimum annular ring as well!
Wayne Thayer
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Ian Hanna
Sent: Monday, November 08, 2010 2:13 PM
To: [log in to unmask]
Subject: Re: [TN] Micro Via Tolerance
+0/-.005" -- "May be plated shut" -- FHS is irrelevant for vias --
Cheers
-- Ian
"Harner, Chester" <[log in to unmask]> Sent by: TechNet <[log in to unmask]>
11/08/2010 02:06 PM
Please respond to
TechNet E-Mail Forum <[log in to unmask]>; Please respond to "Harner, Chester" <[log in to unmask]>
To
[log in to unmask]
cc
Subject
[TN] Micro Via Tolerance
Hi All - We specify +-.003 tolerance for most plated holes. I can't find any reference to tolerance specification for Mico-Vias. +-.003 seems a bit loose for .005 dia holes produced by laser.
Chet Harner Sr. Engineer Crane Hydro-Aire PO Box 7722 Burbank Ca -
91510 818-526-2600 x3557 [log in to unmask]
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