Hi All,

We have a low build electroless Copper plating for Through Hole
metalization, which's giving around 0.5 to 0.6microns of Copper.

The subsequent processes are pattern image printing followed by
pattern plating (electrolytic copper plating).

One of our customer has a requirement to do flash Copper plating
(electro plating) of around 8 to 10 microns, immediately after
electroless Copper plating, prior to pattern image printing.

I want some inputs on the above.....

Is there a distinct advantage on PTH reliability by having
8-10microns of electroplated copper immediately after
electroless Copper plating.

Will having additional flash plating have better Thermal
stress & Thermal Shock performance.

Thanks!
U.Nagaraj



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