Ioan:
A long time ago, people used to use tape to limit plating on buss tabs on PCB, and they inevitably had tape residue remaining after they pulled the tapes off. Do you think your ACF residue might be similar? The cleaner of choice in that by-gone era was an orange oil based product, which was simply wiped on, then water rinsed off.
We still have some of this cleaner from long ago, and if you could test it, it might be a lot easier on your boards than long exposure to NMP and acetone.
Rudy Sedlak
RD Chemical Company
--- On Mon, 11/29/10, Ioan Tempea <[log in to unmask]> wrote:
From: Ioan Tempea <[log in to unmask]>
Subject: [TN] Cleaning of ACF bonder
To: [log in to unmask]
Date: Monday, November 29, 2010, 10:32 AM
Dear Technos,
We need to clean the ACF bonder from a fair quantity of boards (about 1K/ month). The material to clean is Hitachi Anisolm, per the specification below (unfortunately there's not much in this spec)
http://lituo.testmart.cn/Images/UpLoadForderElse/2009_12_30_13_38_38_4939.pdf <http://lituo.testmart.cn/Images/UpLoadForderElse/2009_12_30_13_38_38_4939.pdf>
We have been suggested to use a 48 hour soak in 1-Methyl-2-Pyrrolidinone, followed by an acetone cleaning. It is only the bonding contacts that are immersed in the methyl-pyrr..., but the level of substance is only 2 mm away from an overmolded die-attach. The acetone cleaning is local on the contacts.
First question would be: are the above chemicals OK for this usage? Board is FR4, with gold-plated contacts.
Second question would be: what else could we use to remove the bonder? Manufacturer seems to recommend Dow Corning OS-20, but we were told by our customers it does not exactly work.
Thanks,
Ioan Tempea, ing.
Ingénieur Principal de Fabrication / Senior Manufacturing Engineer
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