Ioan,
Ouch!
I would certainly perform a % weight gain test on a piece of laminate
exposed to the NMP. Am concerned that it will make the laminate swell as
well. Especially a 48 hr soak....
If you have an exhaust hood, would you consider a shorter exposure to heated
NMP? I don't have my chemical dictionary conveniently handy so I can not
cite flash-point, toxicity, etc., but the thinner deposits of the ACF will
be affected much sooner than the laminate.
I presume you have attempted the normal mechanical removal techniques using
dental chisels, etc. Does the ACF adhere really well to both the trace and
the bare laminate, or can you easily "pop" it off the trace and possibly
leave it on the laminate?
Seems like everything I can think of may affect the laminate, or adjacent
devices negatively as well. Hoping that others are having less of a brain
blockage.
Steve Creswick
http://www.linkedin.com/in/stevencreswick
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Ioan Tempea
Sent: Monday, November 29, 2010 3:15 PM
To: [log in to unmask]
Subject: Re: [TN] Cleaning of ACF bonder
Steve,
I need to clean boards that were poorly bonded, trying to remove the
adhesive residue so that they be bonded again.
Thanks,
Ioan Tempea, ing.
Ingénieur Principal de Fabrication / Senior Manufacturing Engineer
T | 450.967.7100 ext.244
E | [log in to unmask]
W | www.digico.cc
N'imprimer que si nécessaire - Print only if you must
-----Message d'origine-----
De : Steven Creswick [mailto:[log in to unmask]]
Envoyé : November-29-10 2:29 PM
À : 'TechNet E-Mail Forum'; Ioan Tempea
Objet : RE: [TN] Cleaning of ACF bonder
Ioan,
I am confused.
Are you attempting to clean the ACF bond head, or the substrate, or both?
Steve Creswick
http://www.linkedin.com/in/stevencreswick
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Ioan Tempea
Sent: Monday, November 29, 2010 1:32 PM
To: [log in to unmask]
Subject: [TN] Cleaning of ACF bonder
Dear Technos,
We need to clean the ACF bonder from a fair quantity of boards (about 1K/
month). The material to clean is Hitachi Anisolm, per the specification
below (unfortunately there's not much in this spec)
http://lituo.testmart.cn/Images/UpLoadForderElse/2009_12_30_13_38_38_4939.pd
f
<http://lituo.testmart.cn/Images/UpLoadForderElse/2009_12_30_13_38_38_4939.p
df>
We have been suggested to use a 48 hour soak in 1-Methyl-2-Pyrrolidinone,
followed by an acetone cleaning. It is only the bonding contacts that are
immersed in the methyl-pyrr..., but the level of substance is only 2 mm away
from an overmolded die-attach. The acetone cleaning is local on the
contacts.
First question would be: are the above chemicals OK for this usage? Board is
FR4, with gold-plated contacts.
Second question would be: what else could we use to remove the bonder?
Manufacturer seems to recommend Dow Corning OS-20, but we were told by our
customers it does not exactly work.
Thanks,
Ioan Tempea, ing.
Ingénieur Principal de Fabrication / Senior Manufacturing Engineer
T | 450.967.7100 ext.244
E | [log in to unmask] <mailto:[log in to unmask]>
W | www.digico.cc <http://www.digico.cc/>
N'imprimer que si nécessaire - Print only if you must
______________________________________________________________________
This email has been scanned by the MessageLabs Email Security System.
For more information please contact helpdesk at x2960 or [log in to unmask]
______________________________________________________________________
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16
for additional information, or contact Keach Sasamori at [log in to unmask] or
847-615-7100 ext.2815
-----------------------------------------------------
______________________________________________________________________
This email has been scanned by the MessageLabs Email Security System.
For more information please contact helpdesk at x2960 or [log in to unmask]
______________________________________________________________________
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16
for additional information, or contact Keach Sasamori at [log in to unmask] or
847-615-7100 ext.2815
-----------------------------------------------------
______________________________________________________________________
This email has been scanned by the MessageLabs Email Security System.
For more information please contact helpdesk at x2960 or [log in to unmask]
______________________________________________________________________
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------
|
