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Date: | Wed, 24 Nov 2010 09:45:08 +0100 |
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Brooks, Bill wrote:
> I was reading an article by Rich Trine from 2005 in
> Circuitree Magazine
> about the subject of Lamination of PTFE based materials for
> multilayer PCB applications...
>
>
<http://www.circuitree.com/Articles/Feature_Article/8a007da6a80f7010VgnVCM10
0000f932a8c0____>
>
> I'm curious if anyone has any experience with this subject and could
> explain the ins and outs of choosing to make a sequential laminated
> multilayer construction with PTFE and polyimide materials combined.
>
> Have things become any easier than the article seems to suggest?
> What would be the limit of sequential laminations you would do? How
> would you deal with the different CTE properties? Also, how would you
> deal with the differences in the temperature requirements for bonding
> of the thermosetting prepregs??
>
> Anyone done anything like this before? How did it turn out?
> Where can I find more research on the subject?
>
Hello Bill,
the pros and cons are very well described in the article and they are still
valid. I'm not aware of any research on this subject but you can find
technical articels from base material suppliers (e.g.
<http://www.rogerscorp.com/acm/literature.aspx>).
We produce PCB with the described techniques, fusion bonding, thermoplastic
and thermoset materials with different bonding temperature, mixed material
multilayer, sequential build ups, etc.
It's very important to use the right material for mixed material multilayer
to avoid warp and twist, barrel cracks etc. I would say that there is no
technical limit for sequential laminations but it's limited by costs.
I recommend that you contact an experienced PCB manufacturer if you have
special requirements.
Best regards
Simon
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