Elaine,
No additional thermal stress is intended. Remember 1) these things were originally written before alt. finishes, so the SnPb finish would be the stress, and 2) this method is sometimes used as a material only test (rather than a full completed board)
Chris
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Brown, Elaine
Sent: Tuesday, November 16, 2010 12:51 PM
To: [log in to unmask]
Subject: [TN] Soldermask adhesion test(IPC-TM-650 2.4.28.1)
The scope of this method :
This test method defines the procedure for determining the adhesion of solder resists (masks) used over melting metals, (such as solder plated and reflowed solder printed boards both prior to and after soldering), nonmelting metals, and printed board substrates.
Says that the test is used before and after solder for only melting metals.
Yet on page 2
5.1.4 Testing is to be conducted on specimens before and after soldering in accordance with J-STD-003, Methods A, B, C, or D with no accelerated aging.
It says that you test a G coupon before, cut it out and do solderability testing on it and test it again.
Are most people doing a before and after with SMOBC?
If you are and are using a G coupon cut, fluxed and solder floated in accordance with J-STD-003,method C do you have to fixture the coupon to pull it? or just hold down the edges?
What do you do if you use a production PB? Do you use it for solderability testing and adhesion test it before and after and then scrap the part?
Thanks in advance
Elaine
Elaine Brown
PWB Quality Engineering
Lockheed Martin Systems Integration - Owego
1801 State Route 17C MD0409
Owego, NY 13827
Phone: 607-751-2015 FAX: 607-751-7796
e-mail: [log in to unmask]
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