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November 2010

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Subject:
From:
Richard Hatano <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Richard Hatano <[log in to unmask]>
Date:
Tue, 16 Nov 2010 11:28:01 -0800
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Hi Everyone,

I hope someone can send me their recommendations (on or off list) on BGA
re-ball kits.
The system will see very light use, only about 1-5 pieces done per month on
BGAs not less than 0.8mm pitch, and less than 300 balls per part.

I think we will place an emphasis on ease of use to get good results over
other factors.
I have been leaning toward the SolderQuik by Winslow, but that is based
on perceived ease of use and not any real data.

Thank you very much for any help you can pass along, and I hope things are
going well for you all.

Richard Hatano
Joby Energy Inc.


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