Rocky,

A few simple suggestions.

Visual inspection will provide input on looping consistency & shape, but
statistical methods such as wire pull or shear will provide much greater
insight on bond quality.

I prefer to perform accelerated aging on the wire by baking at elevated
temps to best determine long term reliability.

Most bonding tool supplier catalogs/web sites can provide insight on tool
selection.  Use these as suggestions, not absolutes - each situation is
different.  Your situation may not be applicable for a 'standard' tool.

Tool life info can also be obtained from supplier.  Tool life is greatly
dependant on the application and tool composition. [for example - are you
over-bonding, are your surfaces and wire clean?  Are the staff properly
handling the bonding tool during insertion, etc?].  When the process is
statistically 'under control', you can gauge tool wear-out by process
characteristic changes.  Many times, the bonding tools are cheap enough that
you should just replace them on a fixed schedule [before they wear out].


Steve Creswick
http://www.linkedin.com/in/stevencreswick


 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Rocky Wang
Sent: Monday, November 15, 2010 1:25 AM
To: [log in to unmask]
Subject: [TN] Wire bonding inspect method and die bonding wedge choiced

Dear Technet:
     After bonding wire, we use the 10x~40x microscope to inspect the wire
bonding quality, how about your section? If need to carry out a higher
magnifying glass to check the bonding wire?
     For the die bonding wedge choice,
     1. How about choose the die bonding wedge, there should has some math
calculation based on the size of the bonding wire & the pad size.
     2. How often do you change the die bonding wedge?
     Thanks anyone can share your comments.

Best Regards
Rocky

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