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November 2010

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Subject:
From:
Rocky Wang <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Rocky Wang <[log in to unmask]>
Date:
Mon, 15 Nov 2010 14:24:30 +0800
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Dear Technet:
     After bonding wire, we use the 10x~40x microscope to inspect the wire bonding quality, how about your section? If need to carry out a higher magnifying glass to check the bonding wire?
     For the die bonding wedge choice,
     1. How about choose the die bonding wedge, there should has some math calculation based on the size of the bonding wire & the pad size.
     2. How often do you change the die bonding wedge?
     Thanks anyone can share your comments.

Best Regards
Rocky

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