Hi Joyce,
Thank-you for your feedback.
I have uploaded the SEM images and added the wire bond configuration.
Please go to file cabinet, not photo galleries.
The wire size is 1.25mil
The wire bonder is K&S 8060 Wedge Bonder Ultrasonic.
2gm is the spec post seal for 1.25 mil Al wire per MIL STD 883- method
2011.
http://ipc-technet.groupsite.com/main/summary
Thank-you, Mumtaz
Mumtaz Bora
Senior Packaging Engineer
Peregrine Semiconductor
9380 Carroll Park Drive
San Diego, CA 92121
858-795-0112-direct
858-731-9499 -fax
[log in to unmask]
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Joyce Koo
Sent: Friday, November 12, 2010 10:11 PM
To: [log in to unmask]
Subject: Re: [TN] Wire Bond Pull failures
(1) Haven't seen the image. What size of the wire? If it is 1mil, you
have problem for sure.
(2) What is the bonder? Break at neck can be resulted poor optimization.
Did you run DOE before? Over travel, bad parameter, contamination on the
pad, etc.
(3) Al to Au is not everybody cup of tea. You need to pay: either pay
for good substrate, good bonder, good operator, pure gold, good wire,
clean pad surface, etc.
(4) 2g does not sounds like hi-rel stuff, someone is cutting corners.
Don't tell me it flights (better not hit the ground).
--------------------------
Sent using BlackBerry
----- Original Message -----
From: Werner Engelmaier [mailto:[log in to unmask]]
Sent: Friday, November 12, 2010 11:35 PM
To: [log in to unmask] <[log in to unmask]>
Subject: Re: [TN] Wire Bond Pull failures
Hi Mumtaz,
Each bond results in slightly different deformation geometry of the wire
which results in different degrees of stress concentration-thus,
differences in the pull strength of these geometries.
What you really need to worry about is where the loading in product is
coming from, what is the magnitude of the loading and whether it is
steady-state or cyclic loading.
You may want to look in the upcoming December issue of Global SMT &
Packaging magazine, where I deal with wire bond fatigue in my
reliability column.
Werner
Upcoming workshops:
November 2 & 9, SMTA Webtorial,
"Fundamentals in Solder Joint Reliability"
December 7 & 14, SMTA Webtorial,
"Acceleration Models, Accelerated Reliability Tests and
ScreeningProcedures"
-----Original Message-----
From: Mumtaz Bora <[log in to unmask]>
To: [log in to unmask]
Sent: Fri, Nov 12, 2010 9:15 pm
Subject: [TN] Wire Bond Pull failures
Hello TechNetters,
I have some wirebonds on a Hi -Rel package that pulled below 2.0 gm
minimum per Mil -Std -883. I have taken some SEM images of failed and
good bonds. Customer has a concern with plane of fracture of the failed
bonds even though it is break at "neck" . . It is Aluminum wire/to
Aluminum bond pad wedge bonded ultrasonically and aluminum wire to gold
plated post also bonded ultrasonic. Wire pull is post seal. I have
uploaded the file of images on the TechNet groupsite .I will appreciate
some feedback from wirebonding experts on the forum.
http://ipc-technet.groupsite.com/main/summary
<http://ipc-technet.groupsite.com/main/summary>
Thank-you, Mumtaz
Mumtaz Bora
Senior Packaging Engineer
Peregrine Semiconductor
9380 Carroll Park Drive
San Diego, CA 92121
858-795-0112-direct
858-731-9499 -fax
[log in to unmask]
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