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Date: | Wed, 10 Nov 2010 07:09:14 -0600 |
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Hello! I recommend you conduct a solderability test in accordance with the
IPC JSTD-003 specification. The issues you describe are root caused in the
plating process and you can demonstrate to your ribbon manufacturer that
the wetting is not acceptable per a consensus standard and that there is a
need to correct the situation. Good Luck.
Dave Hillman
Rockwell Collins
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[TN] Question on ENIG process
Hello technetters.
We have a bad wettability (SnPb process) on some copper ribbons covered by
a Ni layer and Au layer. These are applied by an ENIG process.
The ribbon no-wet area is located on alongside and edges of ribbons. No
issue in the centrum area of the ribbon. The ribbons are 3 mm width and
0.3 mm thick.
The Ni layer and Au layer have the good thickness : 4µm and 0.1 µm. But
with a SEM analysis we see in the bad area a porous Au.
At the degolding operation, the area becomes black, the SnPb don't wet
and the SEM analysis gives a high presence of Phosporus in that area
(Qualitative analysis, the P peak is half the Ni peak).
At soldering operation more you try and worse it is.
The manufacturer of the ribbon says the P in the Ni-P bath is 9%.
Question:
I think the cause is a bad control and homogeneity of the Ni-P bath. Is it
correct or could be another cause as "only" 2/3 of the lot is bad?
After ENIG process, how many P has to remain on the Ni layer ?
Thanks for your answers.
Best regards,
CANTAGALLO Luigi
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