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Mon, 29 Nov 2010 13:32:05 -0500 |
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Dear Technos,
We need to clean the ACF bonder from a fair quantity of boards (about 1K/ month). The material to clean is Hitachi Anisolm, per the specification below (unfortunately there's not much in this spec)
http://lituo.testmart.cn/Images/UpLoadForderElse/2009_12_30_13_38_38_4939.pdf <http://lituo.testmart.cn/Images/UpLoadForderElse/2009_12_30_13_38_38_4939.pdf>
We have been suggested to use a 48 hour soak in 1-Methyl-2-Pyrrolidinone, followed by an acetone cleaning. It is only the bonding contacts that are immersed in the methyl-pyrr..., but the level of substance is only 2 mm away from an overmolded die-attach. The acetone cleaning is local on the contacts.
First question would be: are the above chemicals OK for this usage? Board is FR4, with gold-plated contacts.
Second question would be: what else could we use to remove the bonder? Manufacturer seems to recommend Dow Corning OS-20, but we were told by our customers it does not exactly work.
Thanks,
Ioan Tempea, ing.
Ingénieur Principal de Fabrication / Senior Manufacturing Engineer
T | 450.967.7100 ext.244
E | [log in to unmask] <mailto:[log in to unmask]>
W | www.digico.cc <http://www.digico.cc/>
N'imprimer que si nécessaire - Print only if you must
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