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October 2010

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Subject:
From:
Paul Edwards <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Paul Edwards <[log in to unmask]>
Date:
Tue, 12 Oct 2010 13:47:27 -0700
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From: Paul Edwards [mailto:[log in to unmask]] 
Sent: Tuesday, October 12, 2010 1:41 PM
To: Stadem, Richard D.; [log in to unmask]
Subject: RE: [TN] Mech. damage or poor wetting?

No....I think it means that failure mechanisms of PCAs are no longer simple but a complex interaction of factors AND our F/A tools need to keep up with the complexity and scale of the components and material we use...

I haven't seen a lot of new tools developed for the kind of F/A we are forced to do...

Paul

Paul Edwards
Surface Art Engineering
________________________________________
From: Stadem, Richard D. [mailto:[log in to unmask]] 
Sent: Tuesday, October 12, 2010 1:15 PM
To: Paul Edwards; TechNet E-Mail Forum
Subject: RE: [TN] Mech. damage or poor wetting?

Totally agree, but does that make the CCA unreliable? Typically the rest of the components work just fine over time.
 
From: Paul Edwards [mailto:[log in to unmask]] 
Sent: Tuesday, October 12, 2010 1:24 PM
To: TechNet E-Mail Forum; Stadem, Richard D.
Subject: RE: [TN] Mech. damage or poor wetting?
 
That's just because the BGA balls separate from the substrate more easily due to the defect to joint size ratio and mechanical "flexibility" of the component attachment structure...

You can get what appears to be "black pad" on some "marginal" ENIG PCAs when you "pop" caps or battery terminals and leave them to "age" then remove them...

Paul 

Paul Edwards
Surface Art Engineering


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Stadem, Richard D.
Sent: Tuesday, October 12, 2010 10:38 AM
To: [log in to unmask]
Subject: Re: [TN] Mech. damage or poor wetting?

My experience has been that usually only the BGA pads will exhibit fractures associated with BP. 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Phil Bavaro
Sent: Tuesday, October 12, 2010 12:07 PM
To: [log in to unmask]
Subject: Re: [TN] Mech. damage or poor wetting?

Thus.....etc

I would want to inspect the rest of the board for more evidence of the
black pad, such as the smaller chip caps....for it to only occur at the
perimeter of the bga seems unlikely.  On a chip cap pad which has had
solderpaste melt and interact with the nickel underneath, the dewetting
should be apparent.  

Dye and Pry can be misleading as to the cause of the dye penetration,
especially when there are numerous possible mechanical questions.

Phil



-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Stadem, Richard D.
Sent: Tuesday, October 12, 2010 9:40 AM
To: [log in to unmask]
Subject: Re: [TN] Mech. damage or poor wetting?

It sure looks like Black Pad to me.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Victor Hernandez
Sent: Monday, October 11, 2010 2:41 PM
To: [log in to unmask]
Subject: Re: [TN] Mech. damage or poor wetting?

Was this BGA reworked/repaired.   Is it in close proximity to another
BGA that was RW?  Did the card/board see two consecutive thermal
excursions?


X"

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Thayer, Wayne - IIW
Sent: Monday, October 11, 2010 1:55 PM
To: [log in to unmask]
Subject: Re: [TN] Mech. damage or poor wetting?

Never mind.  I just read the original post.  I'm betting the whole
shebang is due to poor wetting--that's why the correlation to the fanout
escape.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Thayer, Wayne - IIW
Sent: Monday, October 11, 2010 2:52 PM
To: [log in to unmask]
Subject: Re: [TN] Mech. damage or poor wetting?

What's going on with the picture of the cross section?  The ball isn't
wetting down the side of the plated pad.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Chris Mahanna
Sent: Monday, October 11, 2010 2:41 PM
To: [log in to unmask]
Subject: Re: [TN] Mech. damage or poor wetting?

Here are a few pictures
http://ipc-technet.groupsite.com/gallery/16011

this job is a mixed bag.  Currently we suspect soldering, cratering, ICT
and t-cycling damage

Chris

From: [log in to unmask] [mailto:[log in to unmask]]
Sent: Monday, October 11, 2010 2:22 PM
To: TechNet E-Mail Forum; Chris Mahanna
Cc: [log in to unmask]
Subject: Re: [TN] Mech. damage or poor wetting?


Hi Chris - do you have any pictures you can share?

Dave Hillman
Rockwell Collins
[log in to unmask]

Chris Mahanna <[log in to unmask]>
Sent by: TechNet <[log in to unmask]>

10/11/2010 11:29 AM
Please respond to
TechNet E-Mail Forum <[log in to unmask]>; Please respond to
Chris Mahanna <[log in to unmask]>


To

[log in to unmask]

cc

Subject

[TN] Mech. damage or poor wetting?







We have a BGA dye-n-pry job that shows board side sj damage with a
strong correlation to fan-out clocking.
We also have some microsection evidence of poor wetting.
All damage/dye is on perimeters.

Is this an indication of heat sinking and subpar wetting, or can it be
completely mechanical?  Both?

Thanks

Chris

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