Thus.....etc
I would want to inspect the rest of the board for more evidence of the
black pad, such as the smaller chip caps....for it to only occur at the
perimeter of the bga seems unlikely. On a chip cap pad which has had
solderpaste melt and interact with the nickel underneath, the dewetting
should be apparent.
Dye and Pry can be misleading as to the cause of the dye penetration,
especially when there are numerous possible mechanical questions.
Phil
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Stadem, Richard D.
Sent: Tuesday, October 12, 2010 9:40 AM
To: [log in to unmask]
Subject: Re: [TN] Mech. damage or poor wetting?
It sure looks like Black Pad to me.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Victor Hernandez
Sent: Monday, October 11, 2010 2:41 PM
To: [log in to unmask]
Subject: Re: [TN] Mech. damage or poor wetting?
Was this BGA reworked/repaired. Is it in close proximity to another
BGA that was RW? Did the card/board see two consecutive thermal
excursions?
X"
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Thayer, Wayne - IIW
Sent: Monday, October 11, 2010 1:55 PM
To: [log in to unmask]
Subject: Re: [TN] Mech. damage or poor wetting?
Never mind. I just read the original post. I'm betting the whole
shebang is due to poor wetting--that's why the correlation to the fanout
escape.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Thayer, Wayne - IIW
Sent: Monday, October 11, 2010 2:52 PM
To: [log in to unmask]
Subject: Re: [TN] Mech. damage or poor wetting?
What's going on with the picture of the cross section? The ball isn't
wetting down the side of the plated pad.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Chris Mahanna
Sent: Monday, October 11, 2010 2:41 PM
To: [log in to unmask]
Subject: Re: [TN] Mech. damage or poor wetting?
Here are a few pictures
http://ipc-technet.groupsite.com/gallery/16011
this job is a mixed bag. Currently we suspect soldering, cratering, ICT
and t-cycling damage
Chris
From: [log in to unmask] [mailto:[log in to unmask]]
Sent: Monday, October 11, 2010 2:22 PM
To: TechNet E-Mail Forum; Chris Mahanna
Cc: [log in to unmask]
Subject: Re: [TN] Mech. damage or poor wetting?
Hi Chris - do you have any pictures you can share?
Dave Hillman
Rockwell Collins
[log in to unmask]
Chris Mahanna <[log in to unmask]>
Sent by: TechNet <[log in to unmask]>
10/11/2010 11:29 AM
Please respond to
TechNet E-Mail Forum <[log in to unmask]>; Please respond to
Chris Mahanna <[log in to unmask]>
To
[log in to unmask]
cc
Subject
[TN] Mech. damage or poor wetting?
We have a BGA dye-n-pry job that shows board side sj damage with a
strong correlation to fan-out clocking.
We also have some microsection evidence of poor wetting.
All damage/dye is on perimeters.
Is this an indication of heat sinking and subpar wetting, or can it be
completely mechanical? Both?
Thanks
Chris
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