thus we need some pics at higher magnification, thus many can learn from the 
case, thus Werner can tell how to avoid such mess, thus we all save money, 
thus Werner will get less jobs, thus he will not tell us, thus he will earn 
even more money etc

Inge

----- Original Message ----- 
From: "John Burke" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Tuesday, October 12, 2010 12:15 AM
Subject: Re: [TN] Mech. damage or poor wetting?


>I believe Werner just nailed it....
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Werner Engelmaier
> Sent: Monday, October 11, 2010 1:10 PM
> To: [log in to unmask]
> Subject: Re: [TN] Mech. damage or poor wetting?
>
> Hi Chris,
>
> What do you mean by 'fanout clocking?'
>
>
> I think you have a combination of 'Black Pad' and component warpage.
> 'What points to 'Black Pad' is the periphery location-during soldering the
> periphery gets a lot more heat than the interior, thus more Ni goes into
> solution with Sn, thus leaving a higher P-concentration at periphery pads,
> thus they are weaker, thus component warping causes interfacial separation
> on the periphery & pad cratering where the P-concentration is lower.
> Werner
>
>
>
> -----Original Message-----
> From: Chris Mahanna <[log in to unmask]>
> To: [log in to unmask]
> Sent: Mon, Oct 11, 2010 2:40 pm
> Subject: Re: [TN] Mech. damage or poor wetting?
>
>
> Here are a few pictures
> http://ipc-technet.groupsite.com/gallery/16011
>
> this job is a mixed bag.  Currently we suspect soldering, cratering, ICT 
> and
> t-cycling damage
>
> Chris
>
> From: [log in to unmask] [mailto:[log in to unmask]]
> Sent: Monday, October 11, 2010 2:22 PM
> To: TechNet E-Mail Forum; Chris Mahanna
> Cc: [log in to unmask]
> Subject: Re: [TN] Mech. damage or poor wetting?
>
>
> Hi Chris - do you have any pictures you can share?
>
> Dave Hillman
> Rockwell Collins
> [log in to unmask]
>
> Chris Mahanna <[log in to unmask]>
> Sent by: TechNet <[log in to unmask]>
>
> 10/11/2010 11:29 AM
> Please respond to
> TechNet E-Mail Forum <[log in to unmask]>; Please respond to Chris Mahanna
> <[log in to unmask]>
>
>
> To
>
> [log in to unmask]
>
> cc
>
> Subject
>
> [TN] Mech. damage or poor wetting?
>
>
>
>
>
>
>
> We have a BGA dye-n-pry job that shows board side sj damage with a strong
> correlation to fan-out clocking.
> We also have some microsection evidence of poor wetting.
> All damage/dye is on perimeters.
>
> Is this an indication of heat sinking and subpar wetting, or can it be
> completely mechanical?  Both?
>
> Thanks
>
> Chris
>
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