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October 2010

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From:
"Thayer, Wayne - IIW" <[log in to unmask]>
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TechNet E-Mail Forum <[log in to unmask]>, Thayer, Wayne - IIW
Date:
Mon, 11 Oct 2010 14:51:51 -0400
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What's going on with the picture of the cross section?  The ball isn't wetting down the side of the plated pad.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Chris Mahanna
Sent: Monday, October 11, 2010 2:41 PM
To: [log in to unmask]
Subject: Re: [TN] Mech. damage or poor wetting?

Here are a few pictures
http://ipc-technet.groupsite.com/gallery/16011

this job is a mixed bag.  Currently we suspect soldering, cratering, ICT and t-cycling damage

Chris

From: [log in to unmask] [mailto:[log in to unmask]]
Sent: Monday, October 11, 2010 2:22 PM
To: TechNet E-Mail Forum; Chris Mahanna
Cc: [log in to unmask]
Subject: Re: [TN] Mech. damage or poor wetting?


Hi Chris - do you have any pictures you can share?

Dave Hillman
Rockwell Collins
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Chris Mahanna <[log in to unmask]>
Sent by: TechNet <[log in to unmask]>

10/11/2010 11:29 AM
Please respond to
TechNet E-Mail Forum <[log in to unmask]>; Please respond to
Chris Mahanna <[log in to unmask]>


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Subject

[TN] Mech. damage or poor wetting?







We have a BGA dye-n-pry job that shows board side sj damage with a strong correlation to fan-out clocking.
We also have some microsection evidence of poor wetting.
All damage/dye is on perimeters.

Is this an indication of heat sinking and subpar wetting, or can it be completely mechanical?  Both?

Thanks

Chris

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