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October 2010

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Subject:
From:
Werner Engelmaier <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Werner Engelmaier <[log in to unmask]>
Date:
Wed, 6 Oct 2010 16:42:02 -0400
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 Hi Ioan,
When solder migrates away from it original location, that means that the location it migrates to is significantly hotter. In your reflow process, your solder areas to not get enough heat by convection/radiation because they are 'shielded' by something.
Technically best solution => switch to vapor phase [I suspect you are soldering SAC].

 Caution: I do not know how long your connectors are or what the material of the connector body is, but laptop memory card sockets similar to your connectors have developed SJ failures due to CTE mismatches between PCB and connector body.
Werner


 

 

-----Original Message-----
From: Ioan Tempea <[log in to unmask]>
To: [log in to unmask]
Sent: Wed, Oct 6, 2010 4:06 pm
Subject: [TN] Solder wicking up on the leads of Kyocera connector


Dear Technos,

 

Having this connector, http://www.kyocera-elco.com/prdct/pdf/6281.pdf 
<http://www.kyocera-elco.com/prdct/pdf/6281.pdf>  and for a while we have been 
fighting with insufficient solder. After a closer look I realized that solder 
goes really high on the leads, probably through capillary action, and away from 
the joints. Please see this gallery http://ipc-technet.groupsite.com/gallery/15945

 

Are you familiar with this component/phenomenon and how can I fix it?

 

Needless to say, the board has many fine features, so the stencil is 5 mil 
e-formed and I simply cannot add more thickness. On top of it, I have 44 of 
these babies on one board, 81 pins each.

 

Thanks,

 

Ioan Tempea, ing.
Ingénieur Principal de Fabrication / Senior Manufacturing Engineer
T | 450.967.7100 ext.244
E | [log in to unmask] <mailto:[log in to unmask]>  
W | www.digico.cc <http://www.digico.cc/> 

 
 N'imprimer que si nĂ©cessaire - Print only if you must

 


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