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October 2010

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Subject:
From:
Ioan Tempea <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Ioan Tempea <[log in to unmask]>
Date:
Wed, 6 Oct 2010 16:06:17 -0400
Content-Type:
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Dear Technos,

 

Having this connector, http://www.kyocera-elco.com/prdct/pdf/6281.pdf <http://www.kyocera-elco.com/prdct/pdf/6281.pdf>  and for a while we have been fighting with insufficient solder. After a closer look I realized that solder goes really high on the leads, probably through capillary action, and away from the joints. Please see this gallery http://ipc-technet.groupsite.com/gallery/15945

 

Are you familiar with this component/phenomenon and how can I fix it?

 

Needless to say, the board has many fine features, so the stencil is 5 mil e-formed and I simply cannot add more thickness. On top of it, I have 44 of these babies on one board, 81 pins each.

 

Thanks,

 

Ioan Tempea, ing.
Ingénieur Principal de Fabrication / Senior Manufacturing Engineer
T | 450.967.7100 ext.244
E | [log in to unmask] <mailto:[log in to unmask]>  
W | www.digico.cc <http://www.digico.cc/> 

 
 N'imprimer que si nécessaire - Print only if you must

 


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