Ann,
You may not love my opinion. Personally, I think that the beta or whatever
thickness testing is not telling much about the wetting and final solder
joint quality. Instead one should rely upon a solder wetting (balance)
testing combined with solder ball shear tests. Depending on what customer
you have, there may be necessary with even more tests, e.g. tempcycling and
ageing tests with X-sectioning and SEM/EDX. But there are simpler ways to
start with . A experienced quality/process engineer can use a hard
typewriter eraser and get a good opinion just by making a few strikes (not
recommended for everyone to do!). Furthermore, you can use IPC-4552, which
involves tape testing. Again, I don't say Fisherscope is improper, but it is
not a fair judge.
Myself, I gave our istrument to people who plated car details, motorway stel
barriers and such things. THERE, it's very worthful.
Please, don't throw bottles on me. At least not if they are empty.
Inge
PS. If you are lucky to have a very good SEM driver, he/she can estimate the
flash gold by doing a programmed stepwise scan with Backscatter detector
(the acc voltage is important). Calibrate the grayscale level by means of
sputtered gold on a nickel plate.
----- Original Message -----
From: "IMI TAN, Ann Jovelyn B." <[log in to unmask]>
To: <[log in to unmask]>
Sent: Thursday, October 28, 2010 1:00 PM
Subject: [TN] FW: Inquiry on ENIG thickness Measurements
Hi Technet Members,
We have been encountering several miscorrelation callouts with our
suppliers with regards to the measurement of the ENIG coating of the
PCBs we order from them. This is considering different equipment sets
used (suppliers normally use the Oxford CMI 900 while we use the
Fischerscope XDAL), and collimator sizes. All other settings are taken
from IPC 4552. I would like to clarify a few points:
1. When taking the actual thickness to be reported, should we take
readings from multiple pads and take the average? Should the average be
the reported value? In case one pad fails but the average passes, should
the board be judged as acceptable?
2. Does the IPC 6012 rev C supersede even the Amendment in IPC
6012 B which states that the requirement for gold thickness only applies
to non-solderable surfaces? Does this mean that the 0.05um minimum
thickness specified in the IPC 6012 C would apply to all pads?
Thank you,
Ann Jovelyn B. Tan
Supplier Quality Engineer
Corporate Quality and Reliability
Integrated Microelectronics, Incorporated
#103 Trade Avenue cor Technology Avenue
Special Export Processing Zone
Laguna Technopark, Phase 4 Binan, Laguna 4024
Philippines
Tel: +63 49 541 2440 to 55 local 3569/3550
Mobile: +63 923 288 1127
Email: [log in to unmask]
<mailto:[log in to unmask]>
http://www.global-imi.com <http://www.global-imi.com/>
A member of the IMI group of companies
IMI is a global vertically-integrated electronics manufacturing services
(EMS) provider well-known for its flexible expertise.
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