Unless you have some really gross deviations
If the deflections have affected paste print volume then probably you will
have reduced print efficiency/gasketing in some board areas and you will be
able to see this or have evidence from wipe frequency, backside smearing or
something. This could be reflected in the volume of solder on reflow, so you
might see this after reflow, [although the joints could be within acceptable
limits.]
If printing is not affected then the printed paste deposits will have the
same volume in deflected and non deflected areas. On reflow wetting and
surface tension forces should align the components to the same overall
height.
So: Do the different areas of the boards look the same?
Regards
Mike
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Hart, Dale L CTR USAF
AFMC AFRL/RXSA
Sent: Monday, October 04, 2010 7:26 PM
To: [log in to unmask]
Subject: [TN] pick and place /board deflection
I was on the shop floor and noticed deflection in the 8x8 inch panel that
was being populated. Would the deflection in the middle of the panel cause
components to sit higher on the paste and thus have a slightly higher solder
joint height than components on boards along the rails? Thanks in
advance
Dale L. Hart
Universal Technology Corporation (UTC)
Failure Analysis
1270 North Fairfield Road
Dayton, Ohio 45432-2600
(937) 656-9165
Fax (937) 656-4600
Email: <mailto:[log in to unmask]> [log in to unmask]
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