With regard to PCB microsection, is it a must that microsection has to be done on plated through holes. I received a pre- and post microsection samples from my vendor and noticed that they are done across the plated through via. Of course, the solder cannot flow through the walls of the vias on the post solder sample. Can I accept this post solder sample and use it to verify the fabrication process? If yes, what are the reasons.
 
I am learning the trade by myself and would appreciate I can learn from the experts in the field. If there is any articles on how to interpret the microsection sample for PCB such how to differentiate electroless copper from copper plating and then the tin-lead plating in the wall or pad surface, etc would also be most appreciated.
 
Thanks and Regards,
~ Wee Mei ~

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