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October 2010

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Subject:
From:
"Stadem, Richard D." <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Stadem, Richard D.
Date:
Mon, 4 Oct 2010 13:46:55 -0500
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Depends on the pick and place machine being used. Some have a backpressure trigger to release at a certain amount of pressure in grams, others are purely mechanical and operate off of a programmed shut height.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Hart, Dale L CTR USAF AFMC AFRL/RXSA
Sent: Monday, October 04, 2010 1:26 PM
To: [log in to unmask]
Subject: [TN] pick and place /board deflection

 

I was on the shop floor and noticed deflection in the 8x8 inch panel that
was being populated.  Would the deflection in the middle of the panel cause
components to sit higher on the paste and thus have a slightly higher solder
joint height than components on boards along the rails?       Thanks in
advance

 

Dale L. Hart

Universal Technology Corporation (UTC)

Failure Analysis

1270 North Fairfield Road

Dayton, Ohio  45432-2600

(937) 656-9165

Fax (937) 656-4600

Email:  <mailto:[log in to unmask]> [log in to unmask]

 


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