Hi Technet Members,

 

We have been encountering several miscorrelation callouts with our
suppliers with regards to the measurement of the ENIG coating of the
PCBs we order from them. This is considering different equipment sets
used (suppliers normally use the Oxford CMI 900 while we use the
Fischerscope XDAL), and collimator sizes. All other settings are taken
from IPC 4552. I would like to clarify a few points:

1.       When taking the actual thickness to be reported, should we take
readings from multiple pads and take the average? Should the average be
the reported value? In case one pad fails but the average passes, should
the board be judged as acceptable?

2.       Does the IPC 6012 rev C supersede even the Amendment in IPC
6012 B which states that the requirement for gold thickness only applies
to non-solderable surfaces? Does this mean that the 0.05um minimum
thickness specified in the IPC 6012 C would apply to all pads?

 

 

 

 

Thank you,

Ann Jovelyn B. Tan

Supplier Quality Engineer

Corporate Quality and Reliability

Integrated Microelectronics, Incorporated

#103 Trade Avenue cor Technology Avenue 

Special Export Processing Zone

Laguna Technopark, Phase 4 Binan, Laguna 4024

Philippines

Tel:  +63 49 541 2440 to 55 local 3569/3550

Mobile: +63 923 288 1127

Email: [log in to unmask]
<mailto:[log in to unmask]>             

http://www.global-imi.com <http://www.global-imi.com/> 

 

A member of the IMI group of companies

 

IMI is a global vertically-integrated electronics manufacturing services
(EMS) provider well-known for its flexible expertise. 

 


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