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| Date: | Wed, 27 Oct 2010 16:33:34 -0400 |
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Richard,
You are likely talking about IPC-SM-785.
Werner
Upcoming workshops:
November 2 & 9, SMTA Webtorial,
“Fundamentals in Solder Joint Reliability”
December 7 & 14, SMTA Webtorial,
“Acceleration Models, Accelerated Reliability Tests and ScreeningProcedures”
-----Original Message-----
From: Richard Kraszewski <[log in to unmask]>
To: [log in to unmask]
Sent: Wed, Oct 27, 2010 3:51 pm
Subject: Re: [TN] IPC Thermal Cycle & Shock Document
Sorry - poorly stated below. I don't mean a TM650 method.
I do seem to recall a standard or rather lengthy technical report of
some type. It talked about the type stresses being provided by shock
versus cycle, hystereses and the like.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Richard Kraszewski
Sent: Wednesday, October 27, 2010 2:32 PM
To: [log in to unmask]
Subject: [TN] IPC Thermal Cycle & Shock Document
Can't recall this document#.
Can someone recall & let me know?
Many thanks
Rich Kraszewski
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