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October 2010

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Subject:
From:
Paul Edwards <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Paul Edwards <[log in to unmask]>
Date:
Mon, 4 Oct 2010 11:39:04 -0700
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text/plain
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text/plain (89 lines)
Dale,

That depends...

It depends on the type of PnP machine you have...

A Mydata wouldn't care because it is can be driven by upforce where as other PnPs normally are driven by PCB and component thickness...
Thus normal PnPs would vary the placement depth of the component in the solder paste but the Mydata is always the same...

However this feature can have unwanted consequences...

Paul

Paul Edwards
Surface Art Engineering

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Hart, Dale L CTR USAF AFMC AFRL/RXSA
Sent: Monday, October 04, 2010 11:26 AM
To: [log in to unmask]
Subject: [TN] pick and place /board deflection

 

I was on the shop floor and noticed deflection in the 8x8 inch panel that
was being populated.  Would the deflection in the middle of the panel cause
components to sit higher on the paste and thus have a slightly higher solder
joint height than components on boards along the rails?       Thanks in
advance

 

Dale L. Hart

Universal Technology Corporation (UTC)

Failure Analysis

1270 North Fairfield Road

Dayton, Ohio  45432-2600

(937) 656-9165

Fax (937) 656-4600

Email:  <mailto:[log in to unmask]> [log in to unmask]

 


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